IC Packaging Design Engineer - RF/MM-Wave Focus

Socket.dev; San Diego (CA); On-site; USD 136,000 - 184,000; Full time

Benefits offered by this job

Health insurance

401(k) matching

Paid time off

Parental leave

Job summary

Amazon is seeking an IC Packaging Design Engineer to develop power-optimized packaging for mm-wave beamforming SoCs and front-end modules. You will engage with cross-disciplinary teams and third-party suppliers to drive packaging definitions, execution, and optimization.

Responsibilities include defining floorplans and ball maps, running HFSS/Momentum simulations, and advancing AI-driven workflows to accelerate design iterations and performance gains.

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 5+ years of RF design experience, preferably in an advanced node.
• Proven track record of products reaching volume production.
• Experience with RF communication systems.

Responsibilities

• Collaborate with digital design and RF chip designers to define floorplans, bump maps, and ball maps for beamforming ICs.
• Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
• Analyze cost/performance trade-offs and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN, etc.
• Set up and run 3D electromagnetic simulations of package + PCB to verify designs.
• Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
• Assist the thermal team in defining and running thermal simulations of packages and PCBs.
• Collaborate with Antenna and EE teams to design and layout test and application PCBs for packages.
• Advise on qualification of packages: HAST, HTOL, board level reliability, etc.
• Define and implement AI-driven workflows for packaging design to accelerate iterations and optimize performance.

Skills

RF design

Signal integrity

Power integrity

Thermal analysis

Package design

Education

Bachelor's degree in Electrical Engineering

Tools

HFSS

Momentum

Job description

Amazon is seeking an IC Packaging Design Engineer to develop power-optimized packaging for mm-wave beamforming SoCs and front-end modules. You will engage with cross-disciplinary teams and third-party suppliers to drive packaging definitions, execution, and optimization.

Responsibilities include defining floorplans and ball maps, running HFSS/Momentum simulations, and advancing AI-driven workflows to accelerate design iterations and performance gains.