Senior RF IC Packaging Engineer (EM & SI) — Lead

Blue Origin LLC

San Francisco (CA)

On-site

USD 230,000 - 323,000

Full time

4 days ago

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Benefits offered by this job

Medical

Stock Options

401(k) with company match

Paid Time Off

Job summary

Blue Origin LLC is seeking a Senior IC Packaging Engineer based onsite in San Diego, CA, with Bay Area options. You will own electromagnetic simulation for RFIC and mmWave packaging, driving signal and power integrity for high-speed ICs.

Collaboration with RFIC, mmWave, ASIC, and SoC teams is essential, with potential technical leadership of the SI portion of packaging efforts. Requirements include a Bachelor's in EE, 7+ years experience (or PhD-equivalent), and expertise in HFSS/EMX/Momentum.

Qualifications

Bachelor's degree in Electrical Engineering or related field.
7+ years of industry experience or PhD-equivalent research.
Experience with 2.5D/3D EM simulators (HFSS/EMX/Momentum).
Experience with RF modeling and high-speed signal/power integrity.

Responsibilities

Own signal and power integrity for RF/Mixed-Signal and mmWave IC packaging designs.
Perform SI analysis and HFSS simulations for high-speed signals across package interfaces.
Design and analyze power delivery networks using HFSS to meet integrity targets.
Model RF and mmWave packaging with HFSS and related procedures.
Collaborate with RFIC, mmWave, ASIC, and SoC teams on packaging requirements.
Lead the SI portion of package delivery as a technical lead.
Create documentation and support design reviews for packaging deliverables.