Senior RFIC & mmWave Transceiver Architect

Amazon

Sunnyvale (CA)

On-site

USD 183,000 - 248,000

Full time

7 days ago
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Job summary

Amazon Leo is seeking a Senior RFIC Design Engineer to architect, design, and optimize RF front-end modules for Kuiper satellites. You will collaborate with cross-functional teams to define transceiver architectures, perform simulations, and drive area- and power-efficient solutions from concept to production.

You will work on on-chip inductors, baluns, PLLs, and RF blocks, ensuring robust performance across process corners and environmental conditions, with a focus on scalable, cost-effective

Qualifications

  • Bachelor's degree in Electrical Engineering or related field.
  • 7+ years in mm-Wave/RFIC design, preferably at advanced nodes.
  • Knowledge of current and upcoming RF standards (4G/5G NR, WiMAX, 802.11ad).

Responsibilities

  • Collaborate with systems, digital design, and chip teams to specify transceivers and RFIC models.
  • Lead area- and power-efficient RFIC chips with multiple transceiver chains.
  • Work with packaging/HW/EE/FW teams for system integration.
  • Define analog/digital boundary requirements for calibration, clocks, timing.
  • Explore mm-wave/RF architectures and present trade-offs.
  • Design and simulate on-chip inductors, baluns, power combiners in EMX/HFSS.
  • Perform layout, extraction, and sign-off across corners for volume production.
  • Specify bench and production test plans.
  • Guide verification and validation activities.

Skills

mm-Wave RFIC design
transceivers
beamforming
LNA/PA design
RF front-end

Education

Bachelor's degree in Electrical Engineering
Master's degree or Ph.D.

Tools

EMX
HFSS

Job description

Amazon Leo is seeking a Senior RFIC Design Engineer to architect, design, and optimize RF front-end modules for Kuiper satellites. You will collaborate with cross-functional teams to define transceiver architectures, perform simulations, and drive area- and power-efficient solutions from concept to production.

You will work on on-chip inductors, baluns, PLLs, and RF blocks, ensuring robust performance across process corners and environmental conditions, with a focus on scalable, cost-effective

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