Remote SI/PI Engineer - Power & Package Design Lead

TylSemi; San Jose (CA); A distancia; USD 180.000 - 260.000; Jornada completa

Descripción de la vacante

TYLsemi, Inc. is seeking a seasoned SI/PI, Package and Power Delivery Engineer to own signal integrity, power integrity, and package/PDN co-design across chip, package, and board interfaces.

You will collaborate with SoC, physical design, analog, package, board, and validation teams to deliver robust high‑speed links, stable power delivery, and reliable sign‑off from architecture through tapeout. This role suits engineers who enjoy cross‑domain problem solving and turning complex electrical

Formación

• 10+ years of hands-on experience delivering SI/PI and package/PDN solutions for complex SoCs.
• Strong fundamentals in transmission lines, S-parameters, impedance, return paths, coupling/crosstalk, and power delivery behavior across frequency.

Responsabilidades

• Own SI/PI methodology and execution from planning through signoff for high-speed interfaces and power delivery networks.
• Perform package/board/chip co-design: define stackups, routing constraints, via strategies, reference planes, and return-path integrity.
• Model and analyze high-speed channels (SerDes, DDR, PCIe, USB, Ethernet) including insertion/return loss, crosstalk, jitter, eye margins, and equalization tradeoffs.
• Build and validate electrical models (IBIS/IBIS-AMI, S-parameters, SPICE) and ensure model correlation and version control hygiene.
• Own PDN design and analysis across die/package/board: impedance targets, decap strategy, anti-resonance mitigation, and rail stability.
• Run PI signoff including DC/AC IR drop, EM, dynamic droop/noise, and power/ground bounce; drive fixes with clear, reviewable action plans.
• Collaborate with package engineering on substrate routing, escape, ballout, and manufacturability constraints; review and approve package design deliverables.
• Define and enforce design rules/constraints for routing, spacing, shielding, length matching, and reference plane transitions.
• Support lab bring-up and correlation: translate silicon/package/board measurements into model updates and design improvements.
• Create and maintain automation, checks, and reporting (Python/Tcl or equivalent) to improve predictability, repeatability, and execution speed.

Conocimientos

SI analysis

PI/PDN design

Package/PDN co-design

Electrical modeling

Cross-functional execution

Herramientas

HFSS

SIwave

ADS

HSPICE/Spectre

PowerSI

Clarity

RedHawk/Voltus

Descripción del empleo

TYLsemi, Inc. is seeking a seasoned SI/PI, Package and Power Delivery Engineer to own signal integrity, power integrity, and package/PDN co-design across chip, package, and board interfaces.

You will collaborate with SoC, physical design, analog, package, board, and validation teams to deliver robust high‑speed links, stable power delivery, and reliable sign‑off from architecture through tapeout. This role suits engineers who enjoy cross‑domain problem solving and turning complex electrical