Remote Principal Hardware Engineer – DoD Embedded Systems

Curtiss-Wright Corporation; United States; Remote; USD 144,000 - 190,000; Full time

Benefits offered by this job

Paid Time Off

401K with Employer Match and Profit Sh

Health and Wellness Benefits

Learning and Development Opportunities

Referral Program

Competitive Pay

Recognition

Employee Stock Purchase Plan

Inclusive & Supportive Culture

Job summary

Curtiss-Wright Corporation is expanding with a principal hardware engineer role focused on designing complex VPX SBCs, FPGA, switch, and I/O cards. The position emphasizes DoD embedded systems, high-speed mixed-signal design, and leadership across design, testing, and production phases.

The role supports remote work from Massachusetts, with senior responsibilities guiding cross-functional teams and contributing to hardware development strategies and security considerations.

Qualifications

• Bachelor’s degree in Electrical Engineering required; Master’s preferred.
• Minimum 15 years of experience in DoD embedded systems and hardware design (SBC, FPGA, switch, and I/O cards up to 100 GHz); 20+ years preferred.
• Extensive experience designing mixed-signal, high-speed digital, analog, and low-power, high-current circuits in high-reliability environments.
• Proficient in designing high-density interconnect (HDI) PCBs with 26+ layers, Mult lamination, blind/buried vias, and uVia structures.
• Hands-on experience with Siemens Expedition DX Designer (SCH) and Siemens Expedition PCB tools.
• Ability to prioritize tasks, drive results, and work under high-pressure, schedule-driven environments.
• Strong leadership and mentoring skills, capable of architecting and completing complex designs with schedule-based teams.
• Excellent communication skills; proficient in Microsoft Office (Excel, Outlook, PowerPoint).
• US Citizenship required; active DoD security clearance preferred.

Responsibilities

• Collaborate with engineering, project management, test, and operations teams in small, highly integrated, multidisciplinary teams to meet demanding, schedule-driven customer requirements.
• Lead the design and development of 3U and 6U VPX SBC, FPGA, switch, and I/O cards supporting data rates up to 400 GHz.
• Lead the design and development of custom form-factor systems that include SBC, FPGA, switch, and I/O cards, and power supplies and thermal management elements including Liquid-Flow-Through (LFT) methods.
• Support business development, program managers, and customer teams in translating requirements into practical system and functional designs.
• Assess technical and economic feasibility of new designs and act as a team/project lead.
• Provide technical leadership, introduce best practices, and improve product performance, reliability, and time-to-market (TTM).
• Direct and conduct tests to establish standards for new or modified equipment, systems, or processes.
• Develop and maintain technical procedures, documentation, and manuals.

Skills

DoD embedded systems

High-speed digital design

Mixed-signal circuits

Low-power, high-current design

Leadership and mentoring

Project leadership

Requirement translation

Communication

Warranty and reliability mindset

Education

Bachelor’s degree in Electrical Engineering

Master’s degree preferred

Tools

Siemens Expedition DX Designer

Siemens Expedition PCB tools

Job description

Curtiss-Wright Corporation is expanding with a principal hardware engineer role focused on designing complex VPX SBCs, FPGA, switch, and I/O cards. The position emphasizes DoD embedded systems, high-speed mixed-signal design, and leadership across design, testing, and production phases.

The role supports remote work from Massachusetts, with senior responsibilities guiding cross-functional teams and contributing to hardware development strategies and security considerations.