Remote Lead: Substrate Layout for Multi‑Die Packages

Piper Companies; San Jose (CA); Hybride; USD 230 000 - 270 000; Plein temps

Résumé du poste

Piper Companies is seeking a Senior Substrate Layout Designer to lead the design of advanced multi-die substrate packages. The role is onsite 5 days a week in Saratoga, CA or remote to align with Pacific coast time hours.

Responsibilities include end-to-end layout, bump map optimization, routing strategies, and collaboration with ASIC, SI, and power teams to ensure manufacturability. Requires 6–8+ years in substrate layout and a BSEE.

Qualifications

• 6–8+ years of experience in substrate layout design for high-performance IC packaging.
• Experience with organic substrate design from silicon to BGA.
• Knowledge of chiplet-based multi-die packaging (CoWoS) and advanced packaging.

Responsabilités

• Lead end-to-end physical layout of high-density, multi-die substrate design.
• Design and optimize bump maps, breakout routing, vias, and layer stacks.
• Collaborate with ASIC, SI, and power teams on routing strategies.
• Evaluate routing feasibility considering die floorplans and constraints.
• Drive DRC/DFM checks for fabrication readiness.
• Interface with substrate vendors and OSATs for tape-out validation.
• Conduct technical reviews and iterate layout improvements with stakeholders.

Connaissances

Substrate layout design

Chiplet-based multi-die packaging

Cross-functional collaboration

DRC/DFM awareness

Cadence Allegro APD

AutoCAD

Siemens Xpedition

Formation

Bachelor’s degree in Electrical Engineering

Outils

Cadence Allegro APD

AutoCAD

Siemens Xpedition

Description du poste

Piper Companies is seeking a Senior Substrate Layout Designer to lead the design of advanced multi-die substrate packages. The role is onsite 5 days a week in Saratoga, CA or remote to align with Pacific coast time hours.

Responsibilities include end-to-end layout, bump map optimization, routing strategies, and collaboration with ASIC, SI, and power teams to ensure manufacturability. Requires 6–8+ years in substrate layout and a BSEE.