Lead Substrate Layout Engineer – High-Speed Packages

Eridu AI; Saratoga (CA); Vor Ort; USD 150.000 - 230.000; Vollzeit

Zusammenfassung

Eridu, a Silicon Valley hardware startup, is seeking an experienced Substrate Layout Design Engineer to own physical layout for large multi-die organic substrates. You will handle high-density routing, power delivery, and collaboration with ASIC, SI/PI teams and external partners to release designs.

The role requires hands-on layout capability, strong engineering judgment, and experience with Xpedition and Allegro.

Qualifikationen

• 8+ years hands-on experience in advanced IC package substrate layout.
• Experience with multi-die or chiplet-based packages and high I/O counts.
• Proficiency with Siemens Xpedition for substrate layout.

Aufgaben

• Own end-to-end physical layout of advanced organic substrates using Siemens Xpedition, Cadence Allegro including die and component placement, bump map and netlist alignment, escape and breakout routing, via planning, reference planes, and layer stack-up implementation.
• Perform early routing-feasibility studies using die floorplans, I/O placement, package and board interfaces, and manufacturing rules.
• Implement high-speed serial and differential routing with controlled impedance, length/skew management, crosstalk control, and proper return paths.
• Route clock, control, management, and other low-speed interfaces meeting topology and plane requirements.
• Develop robust power and ground distribution for high power devices including plane allocation and PI constraints.
• Support package-to-board co-design and layout of high-speed interface boards with connector and component placements.
• Integrate fine pitch interconnect regions and embedded passives under SI/PI constraints.
• Maintain layout constraints, libraries, docs, and ECOs; generate release packages.
• Lead layout reviews with foundries and suppliers to drive designs to release.

Kenntnisse

Package substrate layout

Multi-die / chiplet packages

High I/O counts

Fine-pitch routing

Power/ground distribution

High-speed routing constraints

Team collaboration

Ausbildung

Bachelor’s degree in electrical/electronics/packaging or related

Tools

Siemens Xpedition

Cadence Allegro Package Designer Plus

Jobbeschreibung

Eridu, a Silicon Valley hardware startup, is seeking an experienced Substrate Layout Design Engineer to own physical layout for large multi-die organic substrates. You will handle high-density routing, power delivery, and collaboration with ASIC, SI/PI teams and external partners to release designs.

The role requires hands-on layout capability, strong engineering judgment, and experience with Xpedition and Allegro.