Substrate & IC Package Layout Engineer — Equity Eligible

Broadcom; San Jose (CA); On-site; USD 141,000 - 226,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity grant

Annual equity awards

Medical insurance

Dental insurance

Vision insurance

401(K) with company matching

Employee Stock Purchase Program (ESPP)

Employee Assistance Program (EAP)

Paid holidays

Paid sick leave

Paid vacation

Job summary

Broadcom in San Jose, CA is seeking an IC Substrate and Package/Interposer Layout Engineer to lead the layout, routing, and validation of high-speed substrates and IC packages. You will use Cadence and other EDA tools, develop script-based layout flows, and collaborate with design, mechanical, electrical, and verification teams to meet specifications, perform DRC/LVS checks, and evaluate parts after fab.

The position offers a base salary range with bonus and equity and a comprehensive benefits

Qualifications

• Bachelor's degree in Material Science/Electrical/Computer/Mechanical Engineering or related science/engineering degree with at least 12 years experience.
• Or Masters degree and 10+ years of related experience or PhD and 7+ years of related experience
• Deep knowledge and expertise with using Cadence layout tools and Electronic Design Automation (EDA) tools.
• Broad understanding of multilayer high speed RF-design, package/substrate manufacturing processes and materials, and surface mount technology
• Simulations of designs and improvement suggestions.

Responsibilities

• Design and layout advanced substrates and IC packages
• Develop and utilize a script-based layout tools.
• Collaborate with design and verification teams to ensure layout meets specifications and performance requirements.
• Perform design rule checking (DRC) and layout vs schematic (LVS) check.
• Contribute to the development and improvement of layout methodologies and flows

Skills

High speed RF design

Layout scripting

DRC/LVS experience

Team collaboration

Education

Bachelor's degree in Engineering (Material Science/Electrical/Computer/Mechanical)

Master's degree

PhD

Tools

Cadence layout tools

EDA tools

Job description

Broadcom in San Jose, CA is seeking an IC Substrate and Package/Interposer Layout Engineer to lead the layout, routing, and validation of high-speed substrates and IC packages. You will use Cadence and other EDA tools, develop script-based layout flows, and collaborate with design, mechanical, electrical, and verification teams to meet specifications, perform DRC/LVS checks, and evaluate parts after fab.

The position offers a base salary range with bonus and equity and a comprehensive benefits