Senior Substrate Layout Design engineer

Piper Companies; San Jose (CA); Hybrid; USD 230,000 - 270,000; Full time

Job summary

Piper Companies is seeking a Senior Substrate Layout Designer to lead the design of advanced multi-die substrate packages. The role is onsite 5 days a week in Saratoga, CA or remote to align with Pacific coast time hours.

Responsibilities include end-to-end layout, bump map optimization, routing strategies, and collaboration with ASIC, SI, and power teams to ensure manufacturability. Requires 6–8+ years in substrate layout and a BSEE.

Qualifications

• 6–8+ years of experience in substrate layout design for high-performance IC packaging.
• Experience with organic substrate design from silicon to BGA.
• Knowledge of chiplet-based multi-die packaging (CoWoS) and advanced packaging.

Responsibilities

• Lead end-to-end physical layout of high-density, multi-die substrate design.
• Design and optimize bump maps, breakout routing, vias, and layer stacks.
• Collaborate with ASIC, SI, and power teams on routing strategies.
• Evaluate routing feasibility considering die floorplans and constraints.
• Drive DRC/DFM checks for fabrication readiness.
• Interface with substrate vendors and OSATs for tape-out validation.
• Conduct technical reviews and iterate layout improvements with stakeholders.

Skills

Substrate layout design

Chiplet-based multi-die packaging

Cross-functional collaboration

DRC/DFM awareness

Cadence Allegro APD

AutoCAD

Siemens Xpedition

Education

Bachelor’s degree in Electrical Engineering

Tools

Cadence Allegro APD

AutoCAD

Siemens Xpedition

Job description

Piper Companies is seeking a Senior Substrate Layout Designer who will be responsible for leading the design of advanced multi-die substrate packages. The layout designer will be onsite 5 days a week in Saratoga, CA or remote working Pacific coast time hours.

Responsibilities for the Substrate Layout Designer include:

• Lead the end-to-end physical layout of high-density, multi-die substrate design.
• Design and optimize bump maps, breakout routing, via structures, and layer stack-ups.
• Collaborate with ASIC, signal integrity, and power teams to ensure clean escape routing and breakout strategies
• Evaluate routing feasibility in co-design environments, considering die floorplans and mechanical constraints.
• Drive DRC, DFM, and manufacturing rule checks to ensure fabrication readiness.
• Interface with substrate vendors and OSATs for tape-out and manufacturability validation.
• Conduct technical reviews and iterate on layout improvements with internal and external stakeholders

Requirements for the Substrate Layout Designer include:

• 6 - 8+ years of experience in substrate layout design for high-performance IC packaging
• Proven experience expertise in organic substrate design from silicon to BGA
• Deep understanding of chiplet-based, multi-die, and advanced packaging (FPGA, CPU, CPU, MCM, CoWoS)
• Strong collaboration skills with ASIC, signal, and power teams
• Proficiency in Cadence Allegro APD, AutoCAD, or Siemens Xpedition.
• Experience working with OSATs and substrate supplies
• Bachelor’s degree in Electrical Engineering or equivalent experience.

Compensation for the Substrate Layout Designer includes:

• Salary range: $230,000 - $270,000
• Comprehensive benefits: Medical, Dental, Vision, 401k, PTO, holidays, and sick leave as required by law.

Keywords: Substrate layout, substrate, package substrate design, multi-die packaging, chiplet integration, CoWoS, MCM, BGA, FPGA, CPU, GPU, High-density interconnect, escape routing, signal integrity, power integrity, organic substrate, substrate tape-out, substrate DRC, cadence allegro APD, autocad, cadence SiP layout, EDA tools, Layout verification tools, ASIC, OSAT, mechanical co-design, floorplanning, design reviews

This job is open for applications on 10/9/2026. Applications for this job will be accepted for at least 30 days from the posting date.