Remote 2.5D/3D Interposer Design Engineer

HCLTech; Sunnyvale (CA); Hybrid; USD 92,000 - 141,000; Full time

Benefits offered by this job

Medical insurance

401(k) retirement plan

10 paid holidays per year

Job summary

HCLTech is seeking a highly skilled Substrait Design Engineer in Sunnyvale, CA, to enhance high-density interconnect solutions for HPC and AI applications. The role includes physical design, routing, and collaboration with teams to ensure production readiness.

The ideal candidate holds an advanced degree in a related field and has significant experience in IC package layout. Offering a competitive salary range of $92,000 to $141,000 with remote work options and robust benefits.

Qualifications

• 3+ years of experience in silicon physical design or IC package layout.
• Understanding of 2.5D/3D advanced packaging.
• Mastery of fine‑line/space lithography.

Responsibilities

• Own the end‑to‑end physical design and layout.
• Execute complex routing for high‑density interconnects.
• Run and resolve physical verification checks.

Skills

Advanced packaging architectures

Layout routing constraints

Signal integrity

Debugging skills

Education

Bachelor’s, Master’s, or Ph.D. in Electrical Engineering

Tools

Siemens EDA Calibre

Ansys (HFSS/SIwave)

Job description

HCLTech is seeking a highly skilled Substrait Design Engineer in Sunnyvale, CA, to enhance high-density interconnect solutions for HPC and AI applications. The role includes physical design, routing, and collaboration with teams to ensure production readiness.

The ideal candidate holds an advanced degree in a related field and has significant experience in IC package layout. Offering a competitive salary range of $92,000 to $141,000 with remote work options and robust benefits.