Remote Substrate IC Package Design Engineer (High-Speed)

Syenta; Tempe (AZ); On-site; USD 130,000 - 160,000; Full time

Benefits offered by this job

Salary range: US $130k – $160k

Early-stage equity opportunities

401(k) potential

Comprehensive health, dental, and vision coverage

15 days PTO and 10 days sick leave

Job summary

Syenta, based in Tempe, Arizona, seeks a highly skilled professional for substrate IC package design, focusing on advanced multi-layered interposers. The role emphasizes electrical, thermal, and mechanical design collaboration. Candidates should have extensive experience in high-performance processor packaging and utilize tools like Allegro Package Designer. Salary ranges from $130k to $160k, with additional equity and benefits.

Qualifications

• 5+ years of experience in substrate IC package design for high-performance processors or accelerators.
• Deep expertise in high-speed signal design and crosstalk mitigation.
• Solid knowledge across electrical, materials, thermal, and mechanical engineering disciplines.

Responsibilities

• Design complex multi-layer substrate interposers and ensure robust signal integrity.
• Perform DRC and LVS verification for all designs.
• Collaborate with cross-functional teams to ensure design feasibility and manufacturability.

Skills

High-speed signal design

Complex layout design

Signal integrity principles

Analytical problem-solving

Education

Bachelor’s or Master’s degree in Electrical Engineering or related field

Tools

Allegro Package Designer

Valor CAM350

Calibre

Job description

Syenta, based in Tempe, Arizona, seeks a highly skilled professional for substrate IC package design, focusing on advanced multi-layered interposers. The role emphasizes electrical, thermal, and mechanical design collaboration. Candidates should have extensive experience in high-performance processor packaging and utilize tools like Allegro Package Designer. Salary ranges from $130k to $160k, with additional equity and benefits.