Substrate IC Design Engineer

ProFound People; Arizona; On-site; USD 120,000 - 180,000; Full time

Job summary

ProFound People is seeking a seasoned engineer to design substrate IC packages for high-performance interposers in a cutting-edge semiconductor environment.

You will shape packaging architectures, drive in-house design of advanced substrate packages, and leverage Allegro Package Designer to manage constraints and routing for large-format, high-density layouts.

Qualifications

• Experience in substrate IC package design for high-performance interposers.
• Strong background in advanced packaging architectures and multi-layer layouts.
• Experience with high-density layouts (>50mm) and SI/PI principles.
• High-speed signal design skills, including crosstalk, reflections, and impedance management.

Responsibilities

• Develop cutting-edge substrate packaging architectures for next-generation interposers.
• Lead design of high-performance IC packages with in-house teams.
• Apply advanced SI/PI principles to package-level design and routing.

Skills

substrate IC package design

advanced packaging architectures

hybrid bonding

Allegro Package Designer

large-format substrate packages

SI/PI principles

high-speed signal design

Tools

Allegro Package Designer

Job description

IC Package Substrate Design for high-performance multi-layer interposers

My client is changing the landscape of semiconductor manufacturing! Their technology completely transcends traditional packaging methods.

This is a high-impact role where you’ll play a key part in developing cutting-edge precision manufacturing processes for next-generation micro-scale technologies

This role includes shaping next-generation packaging architectures, including high-performance chip-to-chip integration solutions. Empowering in-house design of advanced substrate IC packages.

Qualifications required

• Multiple years of experience in substrate IC package design
• Must have strong experience in advanced packaging architectures.
• Experience with hybrid bonding highly regarded.
• Advanced proficiency in Allegro Package Designer (constraint management, routing)
• Extensive experience designing large-format substrate packages (>50mm) with complex, high-density layouts
• Strong understanding of SI/PI principles and their application to package-level design
• Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches