Product Engineer I: 3DIC Packaging & Test Validation

The University of Texas at Austin; Austin (TX); On-site; USD 90,000 - 150,000; Full time

Benefits offered by this job

Health benefits

Tuition assistance

LinkedIn Learning access

Job summary

The University of Texas at Austin through the Texas Institute for Electronics is seeking Product Engineer I–Sr. Product Engineer to drive validation and optimization across advanced 3D/2.5D packaging workflows. You will collaborate with circuit/layout design, process integration, and TEST teams to deliver high-performance, reliable semiconductor packaging solutions.

Roles require a B.E./B.S. in electrical engineering or related field, with senior levels needing extensive experience and strong

Qualifications

• Bachelor’s degree in Electrical Engineering, Semiconductor Physics, Computer Science, Materials Science or relevant field.
• Strong understanding of semiconductor device physics and mixed signal IC behaviors.
• Proficient programming skills in Python, MATLAB, C/C++, or Perl for data analysis and automation.

Responsibilities

• Product and test vehicle validation to specifications; development and optimization of manufacturing/test workflows; 2.5D/3D modeling accuracies; create BKM’s for Power/Thermal/Mechanical/Signal Integrity/RF impacts of multi-chiplet and multi-domain heterogeneous micro-systems.

Skills

Semiconductor physics knowledge

Programming in Python/MATLAB/C/C++/Per

Strong communication & teamwork

Data analysis

Education

Bachelor’s degree in Electrical Engineering, Semiconductor Physics, Computer Science, Materials Science

Master’s degree or PhD in semiconductor engineering fields

Job description

The University of Texas at Austin through the Texas Institute for Electronics is seeking Product Engineer I–Sr. Product Engineer to drive validation and optimization across advanced 3D/2.5D packaging workflows. You will collaborate with circuit/layout design, process integration, and TEST teams to deliver high-performance, reliable semiconductor packaging solutions.

Roles require a B.E./B.S. in electrical engineering or related field, with senior levels needing extensive experience and strong