Impactful Semiconductor Packaging Engineer Intern (MS/PhD)
Texas Instruments
An application made for this job — a tailored resume and cover letter that speak straight to the posting.
Job summary
Texas Instruments is seeking a packaging-focused engineer to interface across multiple work areas to help with the design, development, and analysis of semiconductor packaging technologies for TI's analog and embedded processing products.
You may participate in cross-functional teams to develop internal and external solutions for packaging technologies at different stages of readiness, including Wirebond, Flip Chip, Modules, SIPs, and other advanced packages.
Job description
Texas Instruments is seeking a packaging-focused engineer to interface across multiple work areas to help with the design, development, and analysis of semiconductor packaging technologies for TI's analog and embedded processing products.
You may participate in cross-functional teams to develop internal and external solutions for packaging technologies at different stages of readiness, including Wirebond, Flip Chip, Modules, SIPs, and other advanced packages.
'/%3e%3cpath%20d='M101.744%2012.4726L102.894%2016.1947L99.0021%2013.2201L101.744%2012.4726ZM105.3%208.40937H100.488L99.0026%203.59473L97.5116%208.41047L92.7%208.40385L96.5965%2011.3834L95.1055%2016.1942L99.0021%2013.2196L101.408%2011.3834L105.3%208.40992V8.40937Z'%20fill='white'/%3e%3cdefs%3e%3clinearGradient%20id='paint0_linear_5593_1381'%20x1='90'%20y1='9.44471'%20x2='99'%20y2='9.44471'%20gradientUnits='userSpaceOnUse'%3e%3cstop%20stop-color='%2300AD70'/%3e%3cstop%20offset='0.998594'%20stop-color='%2300B67A'/%3e%3cstop%20offset='1'%20stop-color='%23DCDCE6'/%3e%3c/linearGradient%3e%3c/defs%3e%3c/svg%3e){kind=small}
