Semiconductor Equipment Engineer – Packaging & Lithography

University of Texas; United States; On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Competitive health benefits

Tuition assistance

Paid time off

Professional development

Job summary

The University of Texas at Austin's Texas Institute for Electronics is seeking an Equipment Engineer to ensure the overall equipment effectiveness of semiconductor and packaging process equipment. You will lead installation, maintenance planning, and performance dashboards to support fast learning cycles in advanced packaging.

Qualified candidates hold a bachelor’s degree in engineering and at least three years in a semiconductor fab or packaging facility, with strong communication and

Qualifications

• Bachelor’s degree in an engineering discipline (electrical, chemical, or mechanical) or related field.
• At least three years of engineering experience in a semiconductor fab or semiconductor advanced packaging facility; SPC experience.
• Must be able to work independently with strong interpersonal communication and written skills.

Responsibilities

• Manage installation packages and schedule for equipment in your area.
• Ensure safety compliance and oversee subcontractors during installations.
• Create and maintain equipment specifications, SPC charts, maintenance checklists, and dashboards.
• Participate in tool selections, procurement, upgrade planning, and parts management.
• Drive maintenance programs and contribute to OEE analysis and reporting.

Skills

Statistical Process Control

Equipment installation

Project management

Education

Bachelor's degree in engineering

Master's degree

Job description

The University of Texas at Austin's Texas Institute for Electronics is seeking an Equipment Engineer to ensure the overall equipment effectiveness of semiconductor and packaging process equipment. You will lead installation, maintenance planning, and performance dashboards to support fast learning cycles in advanced packaging.

Qualified candidates hold a bachelor’s degree in engineering and at least three years in a semiconductor fab or packaging facility, with strong communication and