Advanced Semiconductor Packaging Engineer

Texas Instruments; Dallas (TX); On-site; USD 70,000 - 100,000; Full time

Job summary

Texas Instruments is seeking a Packaging engineer as part of the 12-month CAP/TMG Development program for new graduates. You will interface across work areas to design, develop and analyze packaging technologies (Wirebond, Flip Chip, Modules, SIPs) to differentiate TI's analog and embedded processing products.

Join a global team and contribute to reliability, yield, and testability. You will conduct design-of-experiments, select materials, model silicon-to-package interactions, and help ensure

Qualifications

• Bachelor's degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering or related.
• Preferred qualifications include SPC understanding and semiconductor packaging knowledge.

Responsibilities

• Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness.
• Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage.
• Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
• Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs.

Skills

Analytical skills

Problem solving

Communication skills

Team collaboration

Time management

Relationship building

Initiative

Adaptability

SPC knowledge

Semiconductor packaging knowledge

Education

Bachelors degree in Material Science

Job description

Texas Instruments is seeking a Packaging engineer as part of the 12-month CAP/TMG Development program for new graduates. You will interface across work areas to design, develop and analyze packaging technologies (Wirebond, Flip Chip, Modules, SIPs) to differentiate TI's analog and embedded processing products.

Join a global team and contribute to reliability, yield, and testability. You will conduct design-of-experiments, select materials, model silicon-to-package interactions, and help ensure