Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)

Micron Technology; Boise (ID); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

Paid holidays

Job summary

Micron Technology in Boise seeks a Process Integration Lead for Advanced Packaging to guide a team developing and integrating 2.5D/3D packaging technologies from concept to manufacturing. You will drive technology transfer, design rules, and cross-functional collaboration to enable high-performance multi-die solutions.

You will mentor engineers, shape the roadmap for next-generation packaging platforms, and lead efforts in yield, reliability, and data-driven optimization across global teams.

Qualifications

• 15+ years of experience in advanced packaging technology development (2.5D/3D stacking, HBM) and package integration.
• Experience with advanced interconnects, TSVs, die stacking, underfill, molding, bonding, and package integration processes.
• Experience with hybrid bonding integration (W2W/C2W) and HBM-to-logic integration, including thermal optimization.
• Experience defining AI-enabled engineering workflows, developing automation agents, or applying AI tools to semiconductor development.
• Experience leading collaborative technical teams and driving complex engineering programs to completion.

Responsibilities

• Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation.
• Spearhead development, optimization, and qualification of emerging packaging technologies through DOE, process analysis, performance validation, and design rule establishment.
• Improve yield, reliability, and performance using defect analysis, electrical and physical characterization, SPC, and data-driven root cause investigation.
• Lead technology transfer from development to manufacturing, including materials qualification, process readiness, baseline characterization, and validation planning.
• Partner with design, process, equipment, reliability, test, and manufacturing teams to deliver advanced packaging solutions and scale proven methodologies across global organizations.
• Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure-shrinkage controls, and material/process levers; validate with inline metrology.

Skills

Advanced packaging

2.5D packaging

HBM integration

AI-enabled workflows

Team leadership

Education

Bachelor’s degree in Materials/ Chemical Engineering

Tools

DOE (Design of Experiments)

Automation tools

AI tooling in semiconductor development

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro

We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here.

Position Overview

As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team.

Responsibilities

• Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation.
• Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules.
• Improve yield, reliability, and performance using defect analysis, electrical and physical characterization, SPC, and data-driven root cause investigation
• Lead technology transfer from development to manufacturing, including materials qualification, process readiness, baseline characterization, and validation planning
• Partner with design, process, equipment, reliability, test, and manufacturing teams to deliver advanced packaging solutions and scale proven methodologies across global organizations
• Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure-shrinkage controls, and material/process levers; validate with inline metrology.

Minimum Qualifications

• Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field with 15+ years of experience to include advanced packaging technology development, 2.5D, 3D stacking, and HBM integration
• Experience with advanced interconnects, TSVs, die stacking, underfill, molding, bonding, and package integration processes
• Experience with hybrid bonding integration (W2W/C2W) and HBM-to-logic integration, including thermal optimization
• Experience defining AI-enabled engineering workflows, developing automation agents, or applying AI tools to semiconductor development
• Experience leading collaborative technical teams and driving complex engineering programs to completion

Preferred Qualifications

• Master’s degree or PhD
• Experience developing and scaling advanced packaging technologies from research and development through full-scale manufacturing
• Expertise in yield analysis, statistical process control, defect reduction, and data-driven process optimization
• Experience with warpage modeling, material characterization, and package reliability qualification
• Author or contributor to technical publications, patents, or industry presentations related to advanced packaging technologies

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.