Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM)

Micron Technology, Inc.; Boise (ID); On-site; USD 180,000 - 280,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off and holidays

Paid family leave

Job summary

Micron Technology, Inc. in Boise, Idaho seeks a Director/DMTS, Process Integration Lead for Advanced Packaging (2.5D/3D, HBM) to guide a team developing packaging technologies from concept to full‑scale manufacturing.

You will drive technology development, transfer, and collaboration across design, process, equipment, reliability, test, and manufacturing. You will mentor a high‑caliber team and shape roadmaps for next‑generation packaging platforms, enabling AI‑enabled engineering workflows and

Qualifications

• Bachelor's degree in Materials or Chemical Engineering and 15+ years in advanced packaging tech development.
• Experience with 2.5D/3D stacking and HBM integration; strong interconnect knowledge.
• Experience leading collaborative technical teams and driving large programs.

Responsibilities

• Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms.
• Lead development, optimization, and qualification of emerging packaging technologies via DOE and data analysis.
• Coordinate technology transfer from development to manufacturing and ensure design rule establishment.

Education

Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field

Master's degree or PhD

Tools

Advanced interconnects

TSVs

Die stacking

Underfill

Molding

Bonding

HBM integration

AI tools for semiconductor development

Job description

Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM)

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro:

We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next‑generation AI and high‑performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here.

Position Overview:

As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full‑scale manufacturing. This role plays a critical part in enabling high‑performance multi‑die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next‑generation packaging platforms while mentoring a highly skilled technical team.

Responsibilities:

• Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die‑stacking solutions, and HBM implementation.


• Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules.


• Improve yield, reliability, and performance using defect analysis, electrical and physical characterization, SPC, and data‑driven root cause investigation.


• Lead technology transfer from development to manufacturing, including materials qualification, process readiness, baseline characterization, and validation planning.


• Partner with design, process, equipment, reliability, test, and manufacturing teams to deliver advanced packaging solutions and scale proven methodologies across global organizations.


• Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure‑shrinkage controls, and material/process levers; validate with inline metrology.

Minimum Qualifications:

• Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field with 15+ years of experience to include advanced packaging technology development, 2.5D, 3D stacking, and HBM integration.


• Experience with advanced interconnects, TSVs, die stacking, underfill, molding, bonding, and package integration processes.


• Experience with bonding integration and HBM-to-logic integration, including thermal optimization.


• Experience defining AI‑enabled engineering workflows, developing automation agents, or applying AI tools to semiconductor development.


• Experience leading collaborative technical teams and driving complex engineering programs to completion.

Preferred Qualifications:

• Master's degree or PhD.


• Experience developing and scaling advanced packaging technologies from research and development through full‑scale manufacturing.


• Expertise in yield analysis, statistical process control, defect reduction, and data‑driven process optimization.


• Experience with warpage modeling, material characterization, and package reliability qualification.


• Author or contributor to technical publications, patents, or industry presentations related to advanced packaging technologies.

Job Profile(s):

Semiconductor Process Eng SMTS - Semiconductor Process Eng DMTS

Relocation Level: TBD

Benefits:

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.


• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.


• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.


• Additionally, Micron benefits include a robust paid time‑off program and paid holidays.

Equal Opportunity Statement:

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.