MTS Process Integration Engineer | APTD Die Level Technology

Micron Technology; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Job summary

Micron Technology is seeking a Process Integration Engineer for Advanced Packaging to develop and integrate 2.5D/3D architectures, including HBM and hybrid bonding. You will work across engineering disciplines to create new processes, improve performance and yield, and transfer technologies to manufacturing.

You will lead cross-functional efforts, analyze data to drive improvements, and support wafer-to-wafer and chip-to-wafer reliability, with a focus on thermal optimization and scalable

Qualifications

• Bachelor’s degree in Materials Engineering, Chemical Engineering, or related field with 8+ years of experience in advanced packaging development
• Experience with 2.5D, 3D stacking, and HBM integration
• Experience with TSVs, advanced interconnects, die stacking, underfill, molding, bonding, and package integration processes
• Experience with hybrid bonding integration and reliability, including wafer-to-wafer or chip-to-wafer processes
• Experience with HBM and logic integration, including thermal optimization
• Experience supporting cross-functional engineering programs in a fast-paced development environment

Responsibilities

• Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects
• Design and execute experiments to qualify materials, process flows, and design rules for new package architectures
• Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics
• Drive technology transfer, including process qualification, design rules, material selection, and manufacturing readiness
• Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure‑shrinkage controls, and material/process levers; validate with inline metrology
• Collaborate with design, process, equipment, reliability, test, and manufacturing teams to deliver high-performance packaging solutions

Skills

TSVs

Advanced interconnects

Die stacking

Underfill

Molding

Bonding

Package integration

Cross-functional collaboration

Education

Bachelor’s degree in Materials Engineering, Chemical Engineering, or related field

Tools

Data analytics

Automation

AI workflows

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Department Intro

The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology!

Position Overview

As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions.

Responsibilities

• Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects
• Design and execute experiments to qualify materials, process flows, and design rules for new package architectures
• Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics
• Drive technology transfer, including process qualification, design rules, material selection, and manufacturing readiness
• Warpage engineering: predict and mitigate wafer/die warpage via modeling, cure‑shrinkage controls, and material/process levers; validate with inline metrology.
• Collaborate with design, process, equipment, reliability, test, and manufacturing teams to deliver high-performance packaging solutions

Minimum Qualifications

• Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field with 8+ years of experience to include advanced packaging technology development, 2.5D, 3D stacking, and HBM integration
• Experience with TSVs, advanced interconnects, die stacking, underfill, molding, bonding, and package integration processes
• Experience with hybrid bonding integration and reliability, including wafer-to-wafer or chip-to-wafer processes
• Experience with HBM and logic integration, including thermal optimization
• Experience supporting cross-functional engineering programs in a fast-paced development environment

Preferred Qualifications

• Master’s degree or PhD in Materials Engineering, Chemical Engineering, or a related field
• Experience developing thermocompression bonding, microbump, or interposer-based packaging technologies
• Experience using data analytics, automation, or AI-enabled workflows to improve engineering efficiency
• Experience authoring technical papers, patents, or engineering documentation

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.