Senior Technologist, Hybrid Bonding Module

Intel; Hillsboro (OR); On-site; USD 180,770 - 255,200; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement benefits

Vacation time

Job summary

Intel in Hillsboro, Oregon is seeking a Senior Technologist for Die-to-Wafer Hybrid Bonding. This role involves driving process and equipment development for advanced hybrid bonding technologies to enhance performance in high-performance computing and AI.

The ideal candidate holds a Bachelor’s degree and has extensive experience in semiconductor manufacturing. The position requires on-site presence and offers competitive compensation including a salary range of $180,770 - $255,200.

Qualifications

• 9+ years of experience with a Bachelor's degree, 6+ years with a Master's, or 4+ years with a PhD.
• 5+ years of industry experience in hybrid bonding or advanced packaging.

Responsibilities

• Drive process and equipment development for die-to-wafer hybrid bonding.
• Develop manufacturing processes to improve yield and reliability.
• Conduct feasibility studies using characterization and modeling.

Skills

Problem-solving skills

Communication skills

Collaboration skills

Mentorship

Prioritization

Education

Bachelor's, Master's, or PhD in a relevant field

Job description

Role and Impact

As a Senior Technologist for Die-to-Wafer Hybrid Bonding (HBI), you will drive process and equipment development for next-generation hybrid bonding technologies, enabling Intel's leadership in advanced packaging for high-performance computing, AI, and chiplet architectures.

Key Responsibilities

• Drive process and/or equipment development for die-to-wafer hybrid bonding, including material selection, parameter optimization, equipment characterization, and process control.
• Develop and optimize manufacturing processes to improve yield, reliability, and defectivity performance.
• Improve bond interface quality, alignment performance, overlay accuracy, surface preparation, and contamination control.
• Design and execute DOE-based experiments and perform statistical analysis to establish robust process windows and control strategies.
• Lead first-of-a-kind (FOK) process and equipment capability development for new bonding platforms and technologies.
• Identify and implement process and equipment improvements to enhance manufacturing capability, efficiency, and output.
• Conduct process feasibility studies using characterization, modeling, simulation, and experimental methodologies.
• Partner with equipment suppliers and materials vendors to develop enabling process and hardware solutions.
• Collaborate with technology development, process integration, and manufacturing organizations to drive process maturity and continuous improvement.
• Contribute to future technology roadmaps through evaluation of emerging hybrid bonding technologies.

Behavioral Skills

• Demonstrated ability to solve complex technical problems using structured engineering methodologies.
• Strong written and verbal communication skills with the ability to present technical findings to diverse audiences.
• Ability to influence and collaborate across cross-functional teams in technology development and manufacturing environments.
• Proven ability to mentor and develop engineers and technical team members.
• Demonstrated ability to manage multiple priorities and drive results in a fast-paced environment.

Minimum Qualifications

• Bachelor's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 9+ years of experience; OR
• Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 6+ years of experience; OR
• PhD in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related engineering/scientific field and 4+ years of experience.
• 5+ years of industry experience in hybrid bonding, wafer bonding, advanced packaging, or closely related semiconductor manufacturing technologies.

Preferred Qualifications

• Experience leading first-of-a-kind (FOK) process or equipment development programs.
• Experience introducing new hybrid bonding platforms, manufacturing capabilities, or advanced packaging technologies.
• Knowledge of bond interface defect mechanisms, including void formation, adhesion challenges, contamination effects, and material interactions.
• Experience with alignment-sensitive manufacturing processes and overlay performance optimization.
• Experience with process characterization, metrology, defect inspection, or failure analysis techniques.
• Experience improving equipment capability, throughput, utilization, or process performance in a manufacturing environment.
• Experience collaborating with external equipment suppliers and materials vendors on technology development activities.
• Experience supporting technology transfer from development to manufacturing.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Oregon, Hillsboro

Work Model

This role will require an on-site presence.

Benefits

We offer a total compensation package that includes competitive pay, stock bonuses, and benefit programs which encompass health, retirement, and vacation. Annual salary range for US positions: $180,770.00 - 255,200.00 USD.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.