Principal Systems Packaging & Assembly Lead

thrively; Santa Clara (CA); On-site; USD 180,000 - 260,000; Full time

Job summary

Thrively in Santa Clara, CA, seeks a Principal Systems Packaging & Assembly Engineer to lead advanced semiconductor packaging architectures and assembly processes for MEMS, photonic ICs, ASICs, substrates, and precision interfaces.

You will own package configurations, integration strategies, and assembly development across the lifecycle, collaborating with photonics, MEMS, and product teams to optimize performance, reliability, and manufacturability.

Qualifications

• Bachelor's, Master's, or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science, Semiconductor Engineering, or related field.
• Extensive experience in semiconductor packaging, advanced assembly, heterogeneous integration, or related technologies.
• Strong understanding of package architecture, design, materials, and assembly process development.
• Experience with advanced packaging technologies such as SiP, flip-chip, wafer-level packaging, 2.5D/3D integration, or multi-die assemblies.
• Hands-on experience developing and optimizing semiconductor assembly processes.
• Proven ability to take packaging technologies from early development through NPI, qualification, and manufacturing.
• Experience working with OSATs, contract manufacturers, equipment vendors, or external manufacturing partners.
• Strong understanding of packaging reliability, failure analysis, process characterization, DOE, and yield improvement.

Responsibilities

• Lead the design and development of advanced packaging architectures integrating MEMS, photonic devices, ASICs, and interconnects.
• Define package configurations, die placement, substrate and interposer requirements, interconnect strategies, material systems, and assembly methodologies.
• Drive heterogeneous integration approaches, including System-in-Package (SiP), multi-die packaging, and 2.5D/3D packaging.
• Collaborate with photonics, MEMS, electrical, mechanical, and product engineering teams to optimize package performance, manufacturability, and reliability.
• Evaluate trade-offs involving thermal management, mechanical stress, alignment stability, interconnect density, package size, and cost.
• Develop, optimize, and qualify semiconductor packaging and assembly processes, including die attach, flip-chip bonding, wire bonding, adhesives, underfill, and precision component assembly.
• Define assembly sequences, process flows, tooling, fixtures, equipment requirements, and manufacturing documentation.
• Lead hands-on engineering development, prototype builds, process characterization, and DOE activities.
• Identify and resolve complex packaging challenges involving materials compatibility, CTE mismatch, warpage, interfacial reliability, and mechanical stability.
• Support the integration of precision optical and electrical interfaces within complex semiconductor assemblies.
• Lead packaging activities through NPI, engineering validation, qualification, and manufacturing readiness.
• Partner with external assembly/test providers, contract manufacturers, and equipment suppliers.
• Develop and transfer robust, repeatable assembly processes into manufacturing environments.
• Establish process controls, acceptance criteria, manufacturing specifications, and yield improvement strategies.
• Drive root-cause investigations and corrective actions for packaging, assembly, and reliability issues.
• Support manufacturing cost optimization, supplier readiness, and transition toward high-volume production.
• Serve as a senior technical authority for package architecture, assembly integration, and packaging process development.
• Work with engineering leadership to establish packaging strategies and technical roadmaps.
• Provide technical direction across multidisciplinary teams and external manufacturing partners.
• Balance innovative engineering with manufacturability, schedule, reliability, and cost.

Skills

Leadership & cross-functional teamwork

Problem solving

Communication

Education

Bachelor's/Master's/PhD in Mechanical Engineering / Electrical Engineering / Materials Science / Semiconductor Engineering

Job description

Thrively in Santa Clara, CA, seeks a Principal Systems Packaging & Assembly Engineer to lead advanced semiconductor packaging architectures and assembly processes for MEMS, photonic ICs, ASICs, substrates, and precision interfaces.

You will own package configurations, integration strategies, and assembly development across the lifecycle, collaborating with photonics, MEMS, and product teams to optimize performance, reliability, and manufacturability.