Senior MEMS Packaging Engineer - Lead & Innovate

SiTime Corp.; Santa Clara (CA); On-site; USD 180,000 - 260,000; Full time

Benefits offered by this job

401k plan

Health and wellness benefits

Equity grants

Quarterly bonus tied to innovation

Time off plans

Job summary

SiTime Corp. in Santa Clara, CA seeks a Principal Semiconductor Package Engineer to specify, design, develop, and qualify custom packaging for MEMS-based timing products.

Packages include QFN, WLCSP, ceramic, substrate-based and multi-chip modules, integrating MEMS and CMOS components. You will lead package design, development, and release-to-production, manage DoEs locally and overseas, and collaborate with OSATs to prototype and test new designs.

Qualifications

• MS or PhD in Mechanical Engineering, Materials Science, or another relevant field.
• 10+ years in semiconductor IC packaging technology and methodology.
• Experience managing overseas OSATs to bring products into production.
• Knowledge of leadframe-based, flip-chip, and substrate-based packages.
• Experience with flip-chip and bumping technologies.
• Understanding of thermal, stress, and electrical considerations in package design.
• Hands-on experience with CAD software (AutoCAD preferred but not required).
• English proficiency in a professional business environment.

Responsibilities

• Develop new packaging technology for SiTime’s MEMS-based timing solutions
• Lead activities for package design, development, and release-to-production
• Develop, manage, and analyze DoEs running locally and overseas
• Work with OSATs to prototype and test new custom package designs
• Ensure new technologies achieve required performance, reliability, and quality requirements
• Lead troubleshooting activities related to package design or performance

Skills

CAD software

English proficiency

Education

MS/PhD in Mechanical Engineering or Materials Science

Tools

AutoCAD

Job description

SiTime Corp. in Santa Clara, CA seeks a Principal Semiconductor Package Engineer to specify, design, develop, and qualify custom packaging for MEMS-based timing products.

Packages include QFN, WLCSP, ceramic, substrate-based and multi-chip modules, integrating MEMS and CMOS components. You will lead package design, development, and release-to-production, manage DoEs locally and overseas, and collaborate with OSATs to prototype and test new designs.