Principal MEMS Package Engineer - Global Packaging Leader

SiTime Corp.; Santa Clara (CA); Sur place; USD 165 000 - 227 000; Plein temps

Avantages offerts par ce poste

Quarterly bonus tied to innovation

Equity grants

401k plan

Résumé du poste

SiTime Corp. is hiring a Principal Semiconductor Package Engineer to design, develop, and qualify unique MEMS-based packaging technologies for precision timing products. You will oversee packaging from concept through release-to-production, coordinate with OSATs, and drive reliability and performance goals.

The role requires 10+ years in IC packaging, advanced degrees, and hands-on CAD experience. Strong emphasis on thermal and electrical considerations, with opportunities for international

Qualifications

• MS or PhD in Mechanical Engineering, Materials Science or related field.
• 10+ years in semiconductor IC packaging technology and methodology.
• Experience managing overseas OSATs to bring products into production.
• Knowledge of leadframe-, flip-chip-, and substrate-based packages.
• Experience with flip-chip and bumping technologies.
• Understanding of thermal, stress, and electrical considerations in package design.
• Hands-on experience with CAD software (AutoCAD preferred).
• Desire to work in a fast-paced, challenging environment.

Responsabilités

• Develop new packaging technology for MEMS-based timing solutions.
• Lead design, development, and release-to-production of packages.
• Develop, manage, and analyze DoEs locally and overseas.
• Manage development activities at OSATs.
• Collaborate with OSATs to prototype and test new package designs.
• Ensure new technologies meet performance, reliability, and quality requirements.
• Lead troubleshooting related to package design or performance.

Connaissances

semiconductor packaging

OSAT management

leadframe packaging

flip-chip packaging

substrate-based packaging

thermal analysis

CAD software

fast-paced environment

Formation

MS/PhD in Mechanical Engineering or Materials Science

Outils

AutoCAD

Description du poste

SiTime Corp. is hiring a Principal Semiconductor Package Engineer to design, develop, and qualify unique MEMS-based packaging technologies for precision timing products. You will oversee packaging from concept through release-to-production, coordinate with OSATs, and drive reliability and performance goals.

The role requires 10+ years in IC packaging, advanced degrees, and hands-on CAD experience. Strong emphasis on thermal and electrical considerations, with opportunities for international