Senior MEMS Photonics Packaging Engineer

nEye.ai; Santa Clara (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

nEye.ai is seeking a Systems Packaging & Assembly Engineer to lead advanced packaging for MEMS-based silicon photonics switching platforms in Santa Clara. You will own packaging architecture, integration, and NPI from concept through high-volume production.

The role requires deep expertise in MEMS, optical modules, and multi-die assemblies, with leadership across OSATs, CM, and internal teams to ensure scalable, high-performance packaging solutions.

Qualifications

• Bachelor's or Master's in engineering in a relevant field.
• 15+ years in semiconductor or photonics packaging.
• Experience in IC package design and back-end assembly in a manufacturing environment.
• Expertise in flip-chip and wirebond hybrid assemblies (BGA/FCBGA/CSP/WLCSP).
• Proven ability to lead NPI programs from concept to high-volume production.
• Hands-on experience with OSATs and contract manufacturers.
• Strong knowledge of yield improvement, failure analysis, and process development.

Responsibilities

• Define and codesign package substrates for MEMS-based silicon photonics systems.
• Lead package and assembly integration of multi-component systems (MEMS, photonics ICs, ASICs).
• Drive integration strategies for electrical, optical, and mechanical interfaces.

Skills

Packaging Engineering

Semiconductor Packaging

NPI Leadership

OSAT Coordination

Manufacturing Integration

Die Bonding

Wire Bonding

Photonic Packaging

Education

Bachelor's or Master's in Mechanical/Electrical Engineering

Master's preferred

Tools

Cadence SiP

AutoCAD

SolidWorks

Job description

nEye.ai is seeking a Systems Packaging & Assembly Engineer to lead advanced packaging for MEMS-based silicon photonics switching platforms in Santa Clara. You will own packaging architecture, integration, and NPI from concept through high-volume production.

The role requires deep expertise in MEMS, optical modules, and multi-die assemblies, with leadership across OSATs, CM, and internal teams to ensure scalable, high-performance packaging solutions.