Lead MEMS Photonics Packaging & Assembly Engineer

nEye Systems, Inc.; Santa Clara (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

nEye.ai seeks a Systems Packaging & Assembly Engineer to lead packaging and assembly development for MEMS-based silicon photonics switching platform. You will bridge R&D and manufacturing, defining substrates and integration methods for high-volume production.

The role requires hands-on expertise in advanced packaging, OSAT collaboration, and program management across engineering teams to ensure scalable, reliable optical switching systems.

Qualifications

• Bachelorfers or Masterfers degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field.
• 15+ years of experience in semiconductor or photonics packaging engineering.
• Extensive experience in IC package design and back-end assembly process development in a manufacturing environment.
• Strong background in advanced packaging technologies (Flip-chip, BGA/FCBGA/CSP/WLCSP, 2.5D/3D, SiP).
• Proven experience driving NPI programs from concept to high-volume production.

Responsibilities

• Define and codesign package substrates for MEMS-based silicon photonics optical switching systems.
• Lead package and assembly integration of complex multi-component systems including MEMS devices, photonic ICs, ASICs and substrates.
• Drive mechanical, electrical, and optical integration strategies for performance, reliability, and manufacturability.
• Collaborate with photonics, MEMS, electrical, and mechanical teams to define packaging requirements and interfaces.
• Lead NPI and manufacturing ramp, qualification, yield ramp, and reliability validation.

Skills

Semiconductor packaging

Photonics packaging

NPI programs

Cross-functional leadership

DOE/FMEA/SPC

Education

Bachelorfers or Masterfers degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field

Tools

Die bonders

Dispenser

Reflow/TCB tools

Wirebonders

CSAM/X-ray/AOI

Job description

nEye.ai seeks a Systems Packaging & Assembly Engineer to lead packaging and assembly development for MEMS-based silicon photonics switching platform. You will bridge R&D and manufacturing, defining substrates and integration methods for high-volume production.

The role requires hands-on expertise in advanced packaging, OSAT collaboration, and program management across engineering teams to ensure scalable, reliable optical switching systems.