Principal SI/PI Design Engineer — High-Speed IC Packaging

Ciena Corporation; New Providence (NJ); On-site; USD 157,100 - 250,900; Full time

Benefits offered by this job

Medical, dental, and vision plans

401(K) with company matching

Employee Stock Purchase Program

Job summary

A leading technology company is seeking a Principal SI/PI Design Engineer to join their New Providence, NJ team. The ideal candidate will own and drive advanced package selection for custom photonic and IC designs. Required qualifications include a BS in Electrical Engineering or Physics and over 5 years of hands-on experience in IC package design. Familiarity with tools such as Advanced Package Designer and SIWave is essential. Competitive salary and comprehensive benefits package offered.

Qualifications

• 5+ years hands-on experience with IC package design.
• Substrate design experience for RF, digital, high speed, and mixed signal die.
• Experience in package design electrical review and SI/PI analysis.

Responsibilities

• Lead the electrical package design for custom in-house photonic, analog, and digital ICs.
• Interface and coordinate with cross-functional groups on new product package selection.
• Simulate and optimize signal/power integrity and RF performance of the package design.

Skills

IC package design

Signal integrity

Power integrity

RF design

Problem-solving skills

Education

BS in Electrical Engineering or Physics

Tools

Advanced Package Designer (APD)

Xpedition Package Designer (XPD)

SIWave

HFSS

Job description

A leading technology company is seeking a Principal SI/PI Design Engineer to join their New Providence, NJ team. The ideal candidate will own and drive advanced package selection for custom photonic and IC designs. Required qualifications include a BS in Electrical Engineering or Physics and over 5 years of hands-on experience in IC package design. Familiarity with tools such as Advanced Package Designer and SIWave is essential. Competitive salary and comprehensive benefits package offered.