Principal SI/PI Design Engineer — High-Speed IC Packaging
Ciena Corporation
New Providence (NJ)
Sur place
USD 157 100 - 250 900
Plein temps
14 jours+
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Avantages offerts par ce poste
Medical, dental, and vision plans
401(K) with company matching
Employee Stock Purchase Program
Résumé du poste
A leading technology company is seeking a Principal SI/PI Design Engineer to join their New Providence, NJ team. The ideal candidate will own and drive advanced package selection for custom photonic and IC designs. Required qualifications include a BS in Electrical Engineering or Physics and over 5 years of hands-on experience in IC package design. Familiarity with tools such as Advanced Package Designer and SIWave is essential. Competitive salary and comprehensive benefits package offered.
Qualifications
5+ years hands-on experience with IC package design.
Substrate design experience for RF, digital, high speed, and mixed signal die.
Experience in package design electrical review and SI/PI analysis.
Responsabilités
Lead the electrical package design for custom in-house photonic, analog, and digital ICs.
Interface and coordinate with cross-functional groups on new product package selection.
Simulate and optimize signal/power integrity and RF performance of the package design.
Connaissances
IC package design
Signal integrity
Power integrity
RF design
Problem-solving skills
Formation
BS in Electrical Engineering or Physics
Outils
Advanced Package Designer (APD)
Xpedition Package Designer (XPD)
SIWave
HFSS
Description du poste
A leading technology company is seeking a Principal SI/PI Design Engineer to join their New Providence, NJ team. The ideal candidate will own and drive advanced package selection for custom photonic and IC designs. Required qualifications include a BS in Electrical Engineering or Physics and over 5 years of hands-on experience in IC package design. Familiarity with tools such as Advanced Package Designer and SIWave is essential. Competitive salary and comprehensive benefits package offered.
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