Director, Optoelectronic IC Packaging & Integration

Ciena Corporation; New Providence (NJ); On-site; USD 236,000 - 376,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(k) with company matching

Employee stock purchase program (ESPP)

Paid holidays, vacation and PTO

Job summary

Ciena Corporation in New Providence, NJ, is seeking an Optoelectronic IC Package Design Director to lead the development of custom photonic, analog, and digital IC packages for next-generation optical modules.

You will own package selection, layout, SI/PI optimization, verification, and tapeout while coordinating with cross-functional teams and contract manufacturers to drive successful product launches and manufacturability.

Qualifications

• BS in Electrical Engineering or Physics required.
• 10+ years hands-on IC package design experience.
• Experience with RF, digital, high-speed, and mixed-signal designs preferred.
• Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers.
• Experience with package design for manufacturing reviews.

Responsibilities

• Own and drive advanced package selection, new product BGA configuration, and package structure.
• Own and manage package development schedules.
• Responsible for package layout, SI/PI optimization, design verification and tapeout.
• Interface with cross-functional groups on new product package selection, feasibility analysis and design.
• Coordinate with CMs and vendors for sourcing existing designs and future product development.
• Simulate and optimize signal and power integrity and RF performance of the package design.

Skills

IC package design

SI/PI

RF

Thermal design

Cross-functional collaboration

Problem solving

Education

BS in Electrical Engineering or Physics

MS or PhD preferred

Tools

APD+SIP

Xpedition Package Designer (XPD)

Cadence tools

SIWave

HFSS

Job description

Ciena Corporation in New Providence, NJ, is seeking an Optoelectronic IC Package Design Director to lead the development of custom photonic, analog, and digital IC packages for next-generation optical modules.

You will own package selection, layout, SI/PI optimization, verification, and tapeout while coordinating with cross-functional teams and contract manufacturers to drive successful product launches and manufacturability.