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Ciena Corporation invites applications for an SI/PI Design Engineer to lead the electrical package design for custom in-house photonic, analog, and digital ICs powering next‑generation optical modules.
You will own advanced package selection, BGA configurations and package structures, and oversee layout, verification, and tapeout. Collaboration across teams will optimize silicon floor plans and interposers, with SIWave/HFSS-based simulations guiding decisions.
As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact.
The annual salary range for this position is $148,600 - $237,400 USD Pay ranges at Ciena are designed to accommodate variations in knowledge, skills, experience, market conditions, and locations, reflecting our diverse products, industries, and lines of business. Please note that the pay range information provided in this posting pertains specifically to the primary location, which is the top location listed in case multiple locations are available. Non-Sales employees may be eligible for a discretionary incentive bonus, while Sales employees may be eligible for a sales commission.
We do not tolerate any form of discrimination.
Ciena is an Equal Opportunity Employer, including disability and protected veteran status.
If contacted in relation to a job opportunity, please advise Ciena of any accommodation measures you may require.
Dig deeper into who we are, what we do, and what you can expect as a member of our team. Meet the people who are shaping the future of communication and explore the culture we’ve built together at CienaLife.