Senior SI/PI Package Design Engineer

Ciena; New Providence (NJ); On-site; USD 148,600 - 237,400; Full time

Job summary

Ciena in the United States seeks an experienced IC package designer to own advanced package selection, SIP layout, and tapeout coordination across cross-functional teams.

Requires a BS in Electrical Engineering or Physics and 5+ years in IC package design; proficiency with APD, SIP, XPD, Cadence, SIWave, HFSS is preferred. This role offers a competitive salary and comprehensive benefits.

Qualifications

• BS in Electrical Engineering or Physics
• 5+ years hands on experience with IC package design

Responsibilities

• Own and drive advanced package selection, new product BGA configuration and package structure
• Responsible for package/SIP layout, optimization, design verification and tapeout
• Interface and coordinate with cross-functional groups throughout Ciena on new product package selection, feasibility analysis and design
• Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
• Simulate and optimize signal/power integrity and RF performance of the package design
• Interface and work with CMs and vendors for the sourcing existing designs and future product development

Job description

Ciena in the United States seeks an experienced IC package designer to own advanced package selection, SIP layout, and tapeout coordination across cross-functional teams.

Requires a BS in Electrical Engineering or Physics and 5+ years in IC package design; proficiency with APD, SIP, XPD, Cadence, SIWave, HFSS is preferred. This role offers a competitive salary and comprehensive benefits.