Head of Optoelectronic IC Packaging Design

Ciena Corporation; Piscataway Township (NJ); On-site; USD 236,000 - 376,000; Full time

Benefits offered by this job

Medical/dental/vision

401(k) and DCPP

ESPP

EAP

Paid holidays

Paid sick leave

Vacation

Job summary

Ciena Corporation in New Jersey is seeking an Optoelectronic IC Package Design Director to lead package development for custom photonic, analog, and digital ICs, supporting next generation optical modules.

You will own package selection and schedules, optimize layout and pinout, coordinate with cross-functional teams, and ensure SI/PI and RF performance while partnering with CMs and vendors.

Qualifications

• BS in Electrical Engineering or Physics; master's or Ph.D. is a plus.
• 10+ years hands-on IC package design experience.
• Strong fundamentals in SI/PI.

Responsibilities

• Own and drive advanced package selection and BGA configuration.
• Manage package development schedules and tapeout.
• Design verification and optimization of SI/PI and RF performance.
• Coordinate with cross-functional teams and suppliers for new designs.

Skills

IC package design

Signal integrity

RF/mixed-signal design

Problem solving

Education

BS in Electrical Engineering or Physics

Tools

APD+SIP

Xpedition Package Designer

Cadence

SIWave

HFSS

Job description

Ciena Corporation in New Jersey is seeking an Optoelectronic IC Package Design Director to lead package development for custom photonic, analog, and digital ICs, supporting next generation optical modules.

You will own package selection and schedules, optimize layout and pinout, coordinate with cross-functional teams, and ensure SI/PI and RF performance while partnering with CMs and vendors.