Micron Technology seeks a Principal Engineer in Boise to drive innovation in advanced packaging technology. You will influence strategic decisions and shape technology roadmaps while collaborating with partners. The ideal candidate has 5+ years in semiconductor packaging, a relevant degree, and deep knowledge of integration strategies. Benefits include choice of medical plans, paid leave, and a robust paid time-off program. Join a team united by a commitment to innovation and excellence.
Qualifications
Over 5 years of professional experience in semiconductor advanced packaging.
Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies.
Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process.
Experience in DRAM manufacturing and OSAT companies.
Collaborate with internal and external partners for seamless technology integration.
Consult and influence technical and strategic decisions.
Analyze competitive trends to enhance Micron’s edge.
Guide development of packaging technology roadmaps.
Skills
Semiconductor advanced packaging
High Bandwidth Memory
2.5D integration
3D integration strategies
Wafer Level Packaging
DRAM manufacturing
Process module engineering
Technical innovation
Data analysis
Education
BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, or Physics
Job description
Micron Technology seeks a Principal Engineer in Boise to drive innovation in advanced packaging technology. You will influence strategic decisions and shape technology roadmaps while collaborating with partners. The ideal candidate has 5+ years in semiconductor packaging, a relevant degree, and deep knowledge of integration strategies. Benefits include choice of medical plans, paid leave, and a robust paid time-off program. Join a team united by a commitment to innovation and excellence.