Principal Engineer – Advanced Packaging & 3D Integration

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 140,000 - 200,000; Full time

Job summary

Micron Technology, Inc. in Boise seeks a Principal Engineer in Advanced Package Technology Development to lead roadmaps and investment decisions, balancing performance, cost, and scalability with deep technical insight.

Based on the Boise campus, you will influence packaging solutions aligned with Micron's objectives, drive collaboration, publish patents, and contribute to long‑term strategic success.

Qualifications

• Over 5 years of professional experience in semiconductor advanced packaging.
• Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding.
• Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking processes.
• Experience in DRAM manufacturing and OSAT companies.

Responsibilities

• Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value.
• Collaborate continuously with internal and external partners to ensure seamless technology integration.
• Consult and influence technical and strategic decisions at senior management levels.
• Analyze and understand competitive trends to improve Micron’s competitive edge.
• Guide the development of packaging technology roadmaps.
• Assess competitive metrics through data intelligence for strategic advantage.
• Define requirements with proven technical data and content.
• Innovate continuously through patents, trade secrets, technical presentations, and papers, leading to build wins and quality improvements.

Skills

Semiconductor advanced packaging

2.5D integration

3D integration

Hybrid bonding

DRAM manufacturing

OSAT experience

Education

Materials Science/Electrical/Chemical/Mechanical Engineering or related field

Tools

Wafer Level Packaging

3D stacking processes

Job description

Micron Technology, Inc. in Boise seeks a Principal Engineer in Advanced Package Technology Development to lead roadmaps and investment decisions, balancing performance, cost, and scalability with deep technical insight.

Based on the Boise campus, you will influence packaging solutions aligned with Micron's objectives, drive collaboration, publish patents, and contribute to long‑term strategic success.