Principal Engineer, Advanced Packaging Innovator

Micron; Boise (ID); On-site; USD 150,000 - 210,000; Full time

Benefits offered by this job

Medical, dental & vision plans

Paid time off

Paid holidays

Benefit programs to protect income

Job summary

Micron Technology, based at the Boise campus, is seeking a Principal Engineer to drive innovation in advanced packaging technology development. You will shape roadmaps and investment priorities by applying deep technical expertise alongside cost and value analyses to enable well‑balanced trade‑offs.

In a collaborative environment you will influence senior management decisions, work with internal and external partners, and guide the development of packaging roadmaps that align with Micron’s

Qualifications

• 5+ years of professional experience in semiconductor advanced packaging.
• BS, MS, or Ph.D. in Materials Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field.
• Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding.
• Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process.
• Experience in DRAM manufacturing and OSAT companies.

Responsibilities

• Deliver high-value, differentiated technology solutions with business impact.
• Collaborate with internal and external partners for seamless technology integration.
• Consult and influence technical and strategic decisions at senior management levels.
• Analyze competitive trends to improve Micron’s edge.
• Guide development of packaging technology roadmaps.
• Define requirements with data and content.
• Innovate through patents and technical papers to build wins and quality improvements.

Skills

Advanced Packaging

3D integration

Hybrid bonding

Wafer Level Packaging

DRAM manufacturing

Education

BS/MS/PhD in Materials Science/Engineering/Physics

Tools

Patterning tools

Data analysis tools

Job description

Micron Technology, based at the Boise campus, is seeking a Principal Engineer to drive innovation in advanced packaging technology development. You will shape roadmaps and investment priorities by applying deep technical expertise alongside cost and value analyses to enable well‑balanced trade‑offs.

In a collaborative environment you will influence senior management decisions, work with internal and external partners, and guide the development of packaging roadmaps that align with Micron’s