Senior Equipment Development Engineer, Advanced Packaging

Micron Technology, Inc; Boise (ID); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Robust paid time-off program

Job summary

Micron Technology, Inc in Boise, Idaho, is seeking a Staff Equipment Development Engineer to lead the development of next-generation wafer and die equipment. This role requires a Master’s degree and at least 2 years of semiconductor engineering experience.

You’ll be responsible for creating strategies for equipment optimization, collaborating with process teams, and conducting comprehensive analyses. Micron offers an excellent benefit program and promotes a culture of personal and professional growth.

Qualifications

• Master’s Degree or equivalent experience in Materials Science, Engineering, or related fields.
• 2+ years of semiconductor process or equipment engineering experience.
• Understanding of post probe and assembly process interactions.

Responsibilities

• Develop hardware roadmaps for post probe wafer and die processing.
• Conduct root cause and failure mode analysis for current hardware.
• Support equipment transfer to production facilities with possible travel.

Skills

Semiconductor process engineering

Design of experiments (DOE)

Statistical Process Control (SPC)

Root cause analysis

Hands-on experience with wafer tools

Education

Master’s Degree in relevant field

Tools

Wafer/assembly tools

Job description

Micron Technology, Inc in Boise, Idaho, is seeking a Staff Equipment Development Engineer to lead the development of next-generation wafer and die equipment. This role requires a Master’s degree and at least 2 years of semiconductor engineering experience.

You’ll be responsible for creating strategies for equipment optimization, collaborating with process teams, and conducting comprehensive analyses. Micron offers an excellent benefit program and promotes a culture of personal and professional growth.