IC Package Design Engineer - SiP/3D-IC for Data Center

Qualcomm; San Diego (CA); On-site; USD 160,000 - 240,000; Full time

Job summary

Qualcomm Technologies, Inc. seeks an IC Package Design Engineer to own advanced package selection, SiP feasibility, and physical design across SoCs.

You will coordinate with multi-functional teams to optimize mechanical, electrical, and thermal performance, and drive verification and automation strategies for efficient package release. Applicants should have a Master’s degree with 5+ years in electrical/mechanical/materials engineering, proficiency with Cadence APD/SiP and xPD, and hands-on

Qualifications

• Master's degree in electrical engineering, mechanical engineering, materials science, or related fields (5+ years).
• Proven fundamentals in electrical, material, thermal, or mechanical engineering fields.
• Experience with sophisticated package configurations (Flip Chip BGA, 2.5D/3D Interposer).

Responsibilities

• Own and drive advanced package selection, new generation product package structure, and configuration optimization.
• Responsible for package/SIP physical design and layout, optimization, DV, and tape out.
• Collaborate with multi-functional teams to optimize mechanical, electrical, and thermal performance for various chips.
• Define and develop design verification and automation strategy to strengthen package design and release flows.
• Optimize package pin-out and ensure SI/PI compliance.
• Drive innovations in package design with vendors and developers; develop CAD tools and verification flows.

Skills

Cadence APD/SiP

Package design

DFM/DFX rules

Electrical/EM theory

SI/PI concepts

Education

Master's degree in electrical/mechanical/materials or related

Tools

Cadence Allegro

xPD/SiP tooling

Calibre

XtractIM

HFSS

Q3D

PowerSI

Job description

Qualcomm Technologies, Inc. seeks an IC Package Design Engineer to own advanced package selection, SiP feasibility, and physical design across SoCs.

You will coordinate with multi-functional teams to optimize mechanical, electrical, and thermal performance, and drive verification and automation strategies for efficient package release. Applicants should have a Master’s degree with 5+ years in electrical/mechanical/materials engineering, proficiency with Cadence APD/SiP and xPD, and hands-on