Principal Electrical Engineer – SiP & High-Speed Hardware

mercurysystemscareers; Arizona; On-site; USD 150,000 - 210,000; Full time

Job summary

Mercury Systems seeks a Principal Electrical Engineer to lead Hardware Design/Substrate Design for rugged, high‑reliability microelectronics in defense, aerospace, and space systems. You will guide SiP architectures, mentor engineers, and drive design-for-manufacturing across teams.

You will own advanced packaging, high‑speed interfaces, FPGA/DAC/ADC activities, and signal integrity analyses, ensuring extreme reliability in harsh environments and supporting proposal efforts with technical BOEs.

Qualifications

• Bachelor’s or higher-level degree in Electrical Engineering, Computer Engineering, or equivalent.
• Typically requires a minimum of 6+ years of microelectronics packaging experience.
• Experience leading microelectronics packaging efforts across cross‑functional engineering teams.
• Strong expertise in electronic circuit design, schematic capture, and troubleshooting across digital, analog, and power circuits.
• Deep knowledge of high‑speed digital design, signal‑integrity fundamentals, IC package stack ups and advanced packaging techniques.
• Experience working directly with substrate and interposer fabricators.
• Experience mentoring junior engineers and leading engineering activities or small technical teams.

Responsibilities

• Lead cross‑functional teams to architect and develop complex System‑in‑Package (SiP) designs from concept through production
• Manage the design of microelectronic digital and RF packaged circuits that meet system and customer requirements
• Execute microelectronics hardware development involving FPGAs, DACs, ADCs, storage devices, and other advanced components
• Design and analyze high‑speed digital interfaces including Ethernet, PCIe, DDR, SATA, USB, and other mission‑critical interfaces
• Lead design quality activities through peer reviews, verification practices, and rigorous testing to minimize integration risk.
• Coordinate with manufacturing and test teams to resolve build issues, support DFM/DFA/DFT efforts, and participate in detailed failure investigations
• Develop schematics and layout for SiPs using Cadence toolsets and collaborate closely with layout and signal‑integrity teams
• Provide hands‑on support during SiP layout and perform signal‑integrity analysis to ensure robust high‑speed performance
• Support proposal development by contributing technical architectures, cost and schedule estimates, and Basis of Estimate (BOE) inputs

Skills

Microelectronics packaging

Schematic capture

High-speed digital design

Signal integrity

Leadership / mentoring

FPGA-based design

Education

Bachelor's or higher in Electrical Engineering

Tools

Cadence

Cadence Allegro APD

Job description

Mercury Systems seeks a Principal Electrical Engineer to lead Hardware Design/Substrate Design for rugged, high‑reliability microelectronics in defense, aerospace, and space systems. You will guide SiP architectures, mentor engineers, and drive design-for-manufacturing across teams.

You will own advanced packaging, high‑speed interfaces, FPGA/DAC/ADC activities, and signal integrity analyses, ensuring extreme reliability in harsh environments and supporting proposal efforts with technical BOEs.