Senior HDI Substrate Layout Engineer

Mercury Systems; Phoenix, Northern (AZ, KY); Hybrid; USD 75,000 - 150,000; Full time

Benefits offered by this job

Bonus opportunities

Health insurance

Life insurance

Disability insurance

Holidays and time off

Employee stock purchase plan

Tuition reimbursement

Professional development platforms

Job summary

Mercury Systems is seeking a Senior Substrate Layout Engineer to lead HDI PCB and substrate layout for rugged microelectronic solutions used in aerospace and defense. You will guide high‑density layout, ensure DFM alignment, and coordinate with suppliers across multiple die, focusing on flip‑chip and interposer strategies.

You will work within a Cadence‑driven workflow, apply JEDEC/IPC specs, and contribute to complex system‑level decisions while supporting cross‑functional teams and security

Qualifications

• Typically requires a minimum of 4+ years of experience as a high‑density package layout designer.
• Proficiency with Cadence APD+ physical and electrical constraint editors and experience with HDI stack‑ups, blind/buried micro‑vias, and fine‑pitch routing.

Responsibilities

• Provide technical leadership focused on high‑speed interfaces and high‑density substrate layout techniques, guiding engineering teams to deliver high‑quality microelectronic solutions
• Drive the design, layout, and analysis of complex electrical and mechanical systems, including high‑density interposers, substrates, and PCB layouts supporting digital, analog, power, and RF signals across multiple die (primarily flip‑chip)
• Coordinate development processes to ensure alignment with supplier DFМ rules and capabilities
• Create fabrication drawings that accurately represent design intent and collaborate with fabrication suppliers to ensure successful technical transfer
• Review artwork, drawings, and design artifacts throughout the layout cycle and during final design reviews for fabrication and assembly
• Support multidisciplinary investigations, feasibility studies, and design trades in collaboration with cross‑functional engineering teams
• Apply systems‑thinking to understand and communicate how design decisions impact the broader system
• Assist the team beyond specific technical discipline as needed to meet program and organizational goals
• This position requires you to have or obtain a government security clearance. Security clearances may only be granted to U.S. citizens.

Skills

HDI layout design

Cadence APD+

Constraint Manager

2.5D devices/interposers

flip‑chip packaging

high‑speed interconnects

CAM tools (CAM350, Blueprint)

JEDEC/IPC specs

Tools

Cadence APD+ toolset

Cadence Constraint Manager

CAM350

Blueprint

Sigrity/Clarity (Ansys/Cadence)

Job description

Mercury Systems is seeking a Senior Substrate Layout Engineer to lead HDI PCB and substrate layout for rugged microelectronic solutions used in aerospace and defense. You will guide high‑density layout, ensure DFM alignment, and coordinate with suppliers across multiple die, focusing on flip‑chip and interposer strategies.

You will work within a Cadence‑driven workflow, apply JEDEC/IPC specs, and contribute to complex system‑level decisions while supporting cross‑functional teams and security