Advanced IC Package Engineer

Gsme; San Jose, Northern (CA, KY); Hybrid; USD 110,000 - 170,000; Full time

Job summary

Gsme seeks an Advanced IC Package Engineer to join our Advanced Package Design team in California. The role focuses on real-world semiconductor packaging, including 2.5D/3D packaging, interposers, and modern design methodologies.

You will gain hands-on experience with multi-layer MLO/RDL layouts and ceramic substrates, while growing under senior mentorship. The ideal candidate has 2+ years in package layout, a strong grasp of SI/PI fundamentals, and is motivated to work across cross-disciplinary

Qualifications

• Bachelors in Electrical/Mechanical/Industrial Engineering, Applied Physics, or related field with strong fundamentals.
• 2+ years of experience in layout of multi-layer MLO/RDL and ceramic substrates.
• Good understanding of impedance control, return paths, and inductance loops.
• Exposure to SI/PI on SERDES, DDR, HSIO routing and familiarity with Cadence tools.

Responsibilities

• Support layout of multi layer MLO/RDL and ceramic substrate packages.
• Work on multi layer stackups including core and coreless packages.
• Apply impedance control, manage return paths and minimize inductance loops.
• Contribute to SI/PI aware routing for SERDES, DDR, HSIO.
• Collaborate with thermal, mechanical, electrical, reliability, and component teams.

Skills

Layout design

MLO/RDL layout

Ceramic substrates

Signal integrity

Power integrity

Impedance control

Return paths

Inductance minimization

SERDES DDR HSIO routing

Cadence tools

Cross-functional collaboration

Education

Bachelor's degree in Electrical Engineering

Tools

Cadence tools

Job description

We are seeking a motivated Advanced IC Package Engineer to join our Advanced Package Design team. This role offers hands on experience with real world semiconductor and package design, working directly on advanced packaging concepts including 2.5D/3D packaging, interposers, and modern package design methodologies. The ideal candidate brings strong layout experience with multi layer MLO/RDL and ceramic substrates, a solid grasp of signal and power integrity fundamentals, and a drive to grow within the global semiconductor industry under close mentorship.

Key Responsibilities

Support layout of multi layer MLO/RDL and ceramic substrate packages.

Work on multi layer stackups involving both core and coreless packages, gaining hands on exposure to advanced packaging concepts like 2.5D/3D packaging, interposers, and modern package design methodologies.

Apply impedance control principles, manage return paths, and minimize inductance loops in package layout.

Contribute to signal integrity (SI) and power integrity (PI) aware routing, including SERDES, DDR, and HSIO (Gen3/4/5/6) where applicable.

Collaborate with thermal, mechanical, electrical, reliability, and component teams to align package design with cross disciplinary requirements.

Stay aware of manufacturing processes and materials relevant to advanced packaging.

Gain experience used across the global semiconductor industry, with clear mentorship from senior engineers and exposure to top tier and startup semiconductor companies.

Qualifications

Bachelor's degree in Electrical Engineering, Mechanical Engineering, Industrial Engineering, Applied Physics, Physics, or a related field, with strong fundamentals in Electrical/Electronic Engineering, Physics, or Mathematics.

2+ years of experience in layout of multi layer MLO/RDL and ceramic substrates.

Basic understanding of package design processes.

Good understanding of impedance control, return paths, and inductance loops, with hands on experience working on multi layer stackups with core and coreless packages.

Exposure to signal integrity (SI) and power integrity (PI) preferred, along with routing experience with SI and PI aware design of SERDES, DDR, and HSIO (Gen3/4/5/6).

Awareness of manufacturing processes and materials used in advanced packaging, plus familiarity with Cadence tools.

Self motivated with strong analytical thinking, and able to work well in teams across multiple disciplines such as thermal, mechanical, electrical, reliability, and component functions.