3D Packaging & Simulation Intern (Hybrid)

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 121,000 - 122,000; Full time

Job summary

Intel Corporation is seeking an Advanced Packaging Integration and Simulation Intern in the United States. The internship focuses on 2.5D/3D integration, chiplet architectures, and wafer-level packaging with emphasis on DOE and data-driven methods.

You will collaborate with researchers and engineers to develop and validate package models, perform thermo-mechanical simulations, and present findings in technical reviews and potential publications.

Qualifications

• 3+ months of academic or professional experience in engineering data analysis, simulation/modeling workflows.

Responsibilities

• Support advanced packaging integration activities across wafer-level and package-level processes.
• Develop and execute Design of Experiments (DOE) to understand relationships among package architecture and performance.
• Build, calibrate, and apply simulation models to assess mechanical characteristics and interconnect quality.
• Conduct thermo-mechanical simulations to evaluate material responses to temperature and loading conditions.
• Analyze inspection, process, and simulation data to identify root causes and improvement paths.
• Collaborate with cross-functional teams to optimize process flows for yield and reliability.

Skills

DOE

Data analysis

Machine learning

Education

PhD in STEM

Tools

Python

MATLAB

JMP

R

Job description

Intel Corporation is seeking an Advanced Packaging Integration and Simulation Intern in the United States. The internship focuses on 2.5D/3D integration, chiplet architectures, and wafer-level packaging with emphasis on DOE and data-driven methods.

You will collaborate with researchers and engineers to develop and validate package models, perform thermo-mechanical simulations, and present findings in technical reviews and potential publications.