Semiconductor Packaging Research Engineer

Intel; Hillsboro (OR); Hybrid; USD 122,000 - 232,000; Full time

Job summary

Intel is seeking a Semiconductor Packaging Research Engineer to drive research for advanced packaging and heterogeneous integration. The role targets experts in either packaging process integration or modeling/simulation, evaluating architectures, materials, interconnects, reliability risks, and manufacturability trade-offs for future products.

Collaborate across research, design, process, materials, reliability, manufacturing, supplier, university, and ecosystem teams; translate product needs

Qualifications

• Master’s or Ph.D. in a relevant engineering field.
• 1+ years’ experience in semiconductor packaging research or related areas.
• Experience with packaging technologies and/or modeling/simulation.
• Strong problem-solving and cross-functional collaboration skills.

Responsibilities

• Research advanced packaging concepts (chiplets, 2.5D/3DIC, interposers).
• Drive process integration learning or modeling to assess feasibility and reliability.
• Define integration flows, DOE plans, and risk mitigation paths.
• Develop and validate models using data from experiments and failure analysis.
• Document outputs via reports, IP, publications, and transfer inputs.

Skills

Advanced packaging

Chiplets

Heterogeneous integration

DOE

Multi-physics modeling

Education

Master's or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science, Applied Physics, Computational Mechanics, Microelectronics, or related field

Tools

ANSYS

Abaqus

COMSOL

HFSS

Cadence

MATLAB

Python

JMP

Job description

Job Details

Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone.

Life at Intel

Position Summary: The Semiconductor Packaging Research Engineer drives technology research for advanced packaging and heterogeneous integration. The role is suited for candidates with expertise in either packaging process integration or modeling/simulation, with a focus on evaluating new architectures, materials, interconnects, reliability risks, and manufacturability trade-offs for future products.

Key Responsibilities

• Research advanced packaging concepts such as chiplets, heterogeneous integration, 2.5D/3DIC, hybrid bonding, interposer, and die-to-die interconnects.
• Drive either process integration learning or modeling/simulation to assess feasibility, reliability, manufacturability, and technology readiness.
• For process integration: define integration flows, research vehicles, DOE, defect/yield learning, qualification evidence, and risk mitigation paths.
• For modeling: develop and validate thermal, thermo-mechanical, electrical, reliability, or multi-physics models using experimental and failure analysis data.
• Translate product needs into research hypotheses, technical plans, and recommendations; document outputs through reports, design guidance, IP, publications, and development-transfer inputs.
• Collaborate across research, design, process, materials, reliability, manufacturing, supplier, university, and ecosystem teams.

Qualifications

Required Qualifications

• Master’s or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science, Applied Physics, Computational Mechanics, Microelectronics, Semiconductor Manufacturing, or related field.
• 1+ years’ experience in semiconductor packaging research, advanced packaging integration, process integration, modeling/simulation, reliability, materials, or heterogeneous integration.
• 1+ years' experience in one or more of the following areas: process integration, research vehicle execution, DOE, defect/yield learning, reliability, model development& validation, or multi-physics simulation.
• 1+ years' experience with advanced packaging technologies such as flip chip, chiplets, 2.5D/3DIC, fan-out, hybrid bonding, interposers, HBM integration, advanced substrates, or die-to-die interconnects.

Preferred Qualifications

• Ph.D. or deep technical specialization in packaging process integration, computational mechanics, thermal sciences, electrical modeling, materials reliability, or microelectronics research and 4+ years of relevant experience.
• Experience with prototype builds, technology readiness assessment, research-to-development transfer, package-system co-optimization, or chip-package-board co-design.
• Modeling tool experience such as ANSYS, Abaqus, COMSOL, HFSS, Cadence, MATLAB, Python, JMP, or equivalent platforms.
• Record of patents, publications, conference presentations, technical reports, methodology development, or competitive technology assessments.
• Ability to turn ambiguous research problems into clear assumptions, experiments, learning milestones, qualification metrics, and actionable recommendations.

Key Competencies

• Advanced packaging research and pathfinding
• Process integration or modeling/simulation expertise
• Heterogeneous integration, chiplet, and advanced substrate knowledge
• DOE, prototype learning, reliability assessment, or model validation
• Technology readiness evaluation and cross-functional communication

Success Measures

• Research outputs identify credible integration options, technology limiters, and trade-offs for future platforms.
• Process integration or modeling results are supported by clear assumptions, evidence, validation data, and documented limitations.
• Prototype, DOE, or simulation learning improves feasibility, reliability, integration robustness, and manufacturability understanding.
• Key risks are identified early with practical mitigation paths and development-transfer recommendations.

Benefits At Intel

Our total rewards package goes above and beyond just a paycheck. Whether you're looking to build your career, improve your health, or protect your wealth, we offer generous benefits to help you achieve your goals. Intel reserves the right to modify, change or discontinue benefit plans at any time in its sole discretion.

Job Type

College Grad

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Additional Locations

US, Oregon, Hillsboro

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US

$122,440.00 - 232,190.00 USD

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.