Advanced Packaging Intern: 3D/2.5D Simulation & Yield

Intel Corporation; Chandler (AZ); Hybrid; USD 121,000 - 122,000; Full time

Job summary

Intel Technology Research is seeking an Advanced Packaging Integration and Simulation Intern to collaborate with researchers and engineers on next-generation package architectures, including 2.5D/3D integration and wafer-level assembly. You will develop DOE plans, build and validate simulation models, and analyze data to drive yield and reliability improvements.

The role offers hands-on experience in packaging integration, process flow definition, and data-driven engineering, with exposure to

Qualifications

• Candidate must be pursuing a PhD degree in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Manufacturing Engineering, or a closely related STEM discipline
• Must be available to work full-time for the duration of a 3-month internship.
• 3+ months of academic or professional experience in lab experiments, engineering data analysis, or simulation/modeling workflows.
• Experience in process integration or hands-on module development.
• Programming or data analysis experience using Python, MATLAB, JMP, R, or similar tools.
• Statistical analysis, DOE, or machine learning for engineering applications.

Responsibilities

• Support advanced packaging integration activities across wafer-level and package-level process flows, including wafer level process, 2.5D/3D integration, chiplet integration, and hybrid bonding-related modules.
• Develop and execute Design of Experiments (DOE) to understand relationships among package architecture, process conditions, material behavior, and electrical/mechanical performance.
• Build, calibrate, and apply simulation models to understand mechanical characteristics of packages, interconnect quality, thermal performance, etc.
• Conduct thermo-mechanical simulations to evaluate material responses to temperature, stress, and package-level loading conditions.
• Analyze inspection, process, and simulation data to identify root causes of integration challenges and recommend improvement paths.
• Collaborate with cross-functional teams to optimize process flows for yield, reliability, manufacturability, and package performance.
• Present findings through technical presentations and potential publications.

Skills

Python

MATLAB

JMP

R

DOE

Data Analysis

Machine Learning for Engineering

Education

PhD in Mechanical Engineering

PhD in Materials Science & Engineering

PhD in Electrical Engineering

Tools

JMP

MATLAB

Python

Finite Element Analysis (FEA)

Job description

Intel Technology Research is seeking an Advanced Packaging Integration and Simulation Intern to collaborate with researchers and engineers on next-generation package architectures, including 2.5D/3D integration and wafer-level assembly. You will develop DOE plans, build and validate simulation models, and analyze data to drive yield and reliability improvements.

The role offers hands-on experience in packaging integration, process flow definition, and data-driven engineering, with exposure to