Packaging R&D Engineer: Substrate Tech & Advanced Packaging

Intel; Phoenix (AZ); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Retirement plan

Job summary

Intel's Chandler, Arizona campus seeks a Packaging Research and Development Engineer for the Module Engineering Backend team. You will develop and scale advanced substrate packaging technologies on the factory floor, collaborating with equipment suppliers and engineers to push technology boundaries.

The role emphasizes hands-on work, DOE planning, and data-driven insights, with travel less than 5% and a focus on innovation that shapes future computing.

Qualifications

• PhD in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or closely related field.
• 1+ years of relevant experience in a science or engineering field (academic research, internships, or professional).

Responsibilities

• Define and establish equipment configurations, process specifications, and integrated process flows for new packaging technologies.
• Plan and conduct comprehensive Design of Experiments (DOEs) to characterize process windows and interactions between processes, equipment, and materials.
• Drive continuous improvements in process capability, quality and reliability, cost and yield, automation, and productivity.
• Lead cross-functional and cross-organizational teams supporting substrate technology development.
• Collaborate with equipment and materials suppliers to evaluate, qualify, and optimize new technologies and solutions.
• Apply advanced analytical and characterization techniques to evaluate organic and inorganic materials and processes.
• Leverage statistical data analysis tools and programming to derive actionable insights from complex datasets.

Skills

Statistical data analysis

Python

Machine learning concepts

Education

PhD in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry

Tools

JMP

JSL

Python

Job description

Intel's Chandler, Arizona campus seeks a Packaging Research and Development Engineer for the Module Engineering Backend team. You will develop and scale advanced substrate packaging technologies on the factory floor, collaborating with equipment suppliers and engineers to push technology boundaries.

The role emphasizes hands-on work, DOE planning, and data-driven insights, with travel less than 5% and a focus on innovation that shapes future computing.