Senior Packaging Equipment Development Manager

Intel; Phoenix (AZ); On-site; USD 181,000 - 255,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health and retirement benefits

Vacation

Job summary

Intel in the United States (Phoenix, AZ) seeks a Packaging Equipment Development Manager to drive innovation in semiconductor packaging, oversee new equipment introductions, and lead a team delivering world-class manufacturing solutions.

You will join Intel's Assembly Technology Development (ATD) organization, focusing on industry-leading packaging solutions, equipment optimization, and high-volume production readiness, shaping the future of semiconductor technology.

Qualifications

• Bachelor's degree with 9+ years of relevant experience.
• Master's degree with 6+ years of relevant experience.
• PhD with 4+ years of relevant experience.

Responsibilities

• Lead a team responsible for equipment development, driving innovative solutions for semiconductor packaging.
• Drive first of kind equipment introduction, development and ensure smooth transitions between development and HVM.
• Manage strategic and tactical decision-making for module engineering activities, ensuring alignment with Intel's operational goals.
• Collaborate with internal and external stakeholders to optimize equipment and processes and solve technical challenges.
• Develop long-term strategies for equipment capabilities to support future requirements.
• Provide mentorship to engineers, fostering technical expertise and leadership within the team.
• Ensure team accountability and drive results through goal setting, performance management and collaboration.
• Champion Intel's values, creating an inclusive and productive work environment.

Skills

Statistical methods

Experimental design

Data analysis

Education

Bachelor's degree in Materials Science/Mechanical Eng./Physics/CEE or related field

Master's degree in above fields

PhD in above fields

Job description

Intel in the United States (Phoenix, AZ) seeks a Packaging Equipment Development Manager to drive innovation in semiconductor packaging, oversee new equipment introductions, and lead a team delivering world-class manufacturing solutions.

You will join Intel's Assembly Technology Development (ATD) organization, focusing on industry-leading packaging solutions, equipment optimization, and high-volume production readiness, shaping the future of semiconductor technology.