Packaging Research and Development Engineer

Intel; Phoenix (AZ); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Retirement plan

Job summary

Intel's Chandler, Arizona campus seeks a Packaging Research and Development Engineer for the Module Engineering Backend team. You will develop and scale advanced substrate packaging technologies on the factory floor, collaborating with equipment suppliers and engineers to push technology boundaries.

The role emphasizes hands-on work, DOE planning, and data-driven insights, with travel less than 5% and a focus on innovation that shapes future computing.

Qualifications

• PhD in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or closely related field.
• 1+ years of relevant experience in a science or engineering field (academic research, internships, or professional).

Responsibilities

• Define and establish equipment configurations, process specifications, and integrated process flows for new packaging technologies.
• Plan and conduct comprehensive Design of Experiments (DOEs) to characterize process windows and interactions between processes, equipment, and materials.
• Drive continuous improvements in process capability, quality and reliability, cost and yield, automation, and productivity.
• Lead cross-functional and cross-organizational teams supporting substrate technology development.
• Collaborate with equipment and materials suppliers to evaluate, qualify, and optimize new technologies and solutions.
• Apply advanced analytical and characterization techniques to evaluate organic and inorganic materials and processes.
• Leverage statistical data analysis tools and programming to derive actionable insights from complex datasets.

Skills

Statistical data analysis

Python

Machine learning concepts

Education

PhD in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry

Tools

JMP

JSL

Python

Job description

Job Details

Intel is one of the world's leading semiconductor companies, driving innovation that shapes the future of technology. From powering the devices people use every day to enabling the next generation of artificial intelligence and computing, Intel's work touches virtually every corner of the modern world. At Intel, we believe in the power of human ingenuity — and we invest in the brilliant minds who make breakthroughs possible. Our Chandler, Arizona campus is home to some of the most advanced semiconductor packaging research and manufacturing capabilities on the planet.

Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Research and Development Engineer to join our Module Engineering Backend team in Chandler, Arizona. This is a rare and exciting opportunity to be part of a world-class, first-of-its-kind embedded die packaging facility — a team that is literally writing the history books of the substrate packaging industry.

In this role, you will be at the forefront of developing and scaling advanced substrate packaging technologies that enable die disaggregation and heterogeneous integration — two of the most critical frontiers in modern semiconductor engineering. You will spend the majority of your time on the factory floor, working hands‑on with cutting‑edge equipment and materials, collaborating with world‑class engineers, and engaging directly with equipment and material suppliers to push the boundaries of what's possible.

If you are passionate about materials science, process engineering, and disruptive technology innovation — and you want your work to have a real, lasting impact on the future of computing — this is the role for you.

Key Responsibilities

• Define and establish equipment configurations, process specifications, and integrated process flows for new and emerging packaging technologies.
• Plan and conduct comprehensive Design of Experiments (DOEs) to fundamentally characterize process windows and understand the complex interactions between processes, equipment, and materials.
• Drive continuous improvements in process capability and stability, quality and reliability, cost and yield, automation, and overall productivity.
• Lead and actively participate in cross‑functional and cross‑organizational teams and working groups that support substrate technology development.
• Engage and collaborate with equipment and materials suppliers to evaluate, qualify, and optimize new technologies and solutions.
• Apply advanced analytical and characterization techniques to evaluate organic and inorganic materials and processes.
• Leverage statistical data analysis tools and programming skills to derive actionable insights from complex datasets.

As a Successful Candidate, You Will Bring

• Communicates clearly and confidently — both in writing and verbally — and thrives in a collaborative team environment.
• Is naturally curious and driven to solve complex, ambiguous problems with creativity and persistence.
• Adapts easily to evolving priorities and is comfortable working with a degree of ambiguity and flexibility.
• Builds strong, productive relationships with colleagues, suppliers, and cross‑functional partners.
• Takes ownership and accountability for your work, and brings a proactive, solutions‑oriented mindset to every challenge.
• Is open to occasional travel (less than 5%) to engage with suppliers and partners.

Are you ready to be part of something historic? Join Intel's world‑class packaging team in Chandler, Arizona and help shape the future of semiconductor technology.

Qualifications

Minimum Qualifications

• PhD degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a closely related field.
• 1+ years of relevant experience in a science or engineering field (obtained through academic research, internships, or professional experience).

Preferred Qualifications

• 1+ years of experience in:
• Engineering troubleshooting and analytical problem‑solving on integrated technology challenges, working within broad, cross‑functional engineering teams.
• Owning and operating process tools, with knowledge of Statistical Process Control (SPC), Process Change Systems (PCS), Request for Change (RFC) processes, equipment troubleshooting, statistical design of experiments, and process development.
• Variety of organic and inorganic materials and processes, including characterization techniques such as DSC, TGA, D/TMA, Titration, ICP-MS, FTIR, XPS, TOF‑SIMS, EDX, and SEM.
• Statistical data analysis tools including JMP, JSL, and Python; familiarity with relational database structures and machine learning concepts.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Additional Locations

-

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00 - 188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.