Onsite Packaging & Collateral Development Engineer

Intel Corporation; Phoenix (AZ); On-site; USD 85,000 - 120,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Phoenix, AZ, is seeking an experienced engineer to develop assembly processes and equipment for next-gen packaging technologies. You will optimize manufacturing to meet quality, reliability, cost, yield and manufacturability targets, while applying DOE and SPC methods and documenting improvements.

The role requires hands-on design and analysis, collaboration with supplier quality, and a focus on process maturity and reliability to support product milestones.

Qualifications

• Bachelor's or higher in a technical field with 6 months of relevant experience.
• Strong knowledge of SPC and DOE concepts.
• Experience with packaging or assembly processes is a plus.

Responsibilities

• Develops assembly processes and equipment to enable Intel's packaging roadmap.
• Optimizes manufacturing efficiency, improving quality, cost and yield.
• Applies experiments and data analysis to specify improvements and document results.

Skills

SPC

DOE

Analytical thinking

Problem solving

Teamwork

Education

Bachelor's in Mechanical Engineering

Master's in Mechanical Engineering

Tools

SolidWorks

AutoCAD

Minitab/JMP (stats software)

Job description

Intel Corporation in Phoenix, AZ, is seeking an experienced engineer to develop assembly processes and equipment for next-gen packaging technologies. You will optimize manufacturing to meet quality, reliability, cost, yield and manufacturability targets, while applying DOE and SPC methods and documenting improvements.

The role requires hands-on design and analysis, collaboration with supplier quality, and a focus on process maturity and reliability to support product milestones.