Frontier Substrate Packaging R&D Engineer

Intel Corporation; Phoenix (AZ); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health, retirement, and vacation benefi

Job summary

Intel Corporation in Chandler, AZ, is seeking a Packaging Research and Development Engineer to join the Module Engineering Backend team. The role focuses on developing advanced substrate packaging technologies, working hands-on on the factory floor, and collaborating with equipment and material suppliers to push boundaries.

Responsibilities include defining process flows, conducting DOEs, and driving improvements in cost, yield, and productivity.

Qualifications

• PhD required in a related engineering field with strong research background.
• 1+ years of relevant engineering or science experience.
• Experience troubleshooting and solving complex cross-functional challenges.

Responsibilities

• Define equipment configurations, process specs, and integrated flows for new packaging technologies.
• Plan and conduct DOEs to characterize process windows and interactions.
• Drive improvements in process capability, quality, cost, and productivity.
• Lead cross-functional teams supporting substrate technology development.
• Collaborate with suppliers to evaluate and optimize new technologies.
• Apply analytical methods to evaluate materials and processes, and derive insights.

Skills

Engineering troubleshooting

Analytical problem solving

Cross-functional teamwork

Statistical design of experiments

Education

PhD in Mechanical Engineering / Chemical Engineering / Materials Science / Physics / Chemistry or related field

Tools

JMP

JSL

Python

Job description

Intel Corporation in Chandler, AZ, is seeking a Packaging Research and Development Engineer to join the Module Engineering Backend team. The role focuses on developing advanced substrate packaging technologies, working hands-on on the factory floor, and collaborating with equipment and material suppliers to push boundaries.

Responsibilities include defining process flows, conducting DOEs, and driving improvements in cost, yield, and productivity.