Advanced Packaging Process Engineer: High-Impact

Intel Corporation; Chandler (AZ); On-site; USD 115,000 - 220,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Job summary

Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, Arizona seeks a Packaging Module Development Engineer to advance packaging processes, drive optimization, and qualification for high‑volume production.

You will design and execute experiments using SPC and DOE, collaborate with cross‑functional engineering, manufacturing, and product teams, and contribute to reliable, cost‑effective packaging solutions that scale globally.

Qualifications

• MSc or PhD in a STEM field with 1+ years in related work or 3+ years experience with a Master’s degree.
• Experience in manufacturing environment and process development.
• Familiarity with SPC, DOE, data analysis, and packaging/reliability concepts.

Responsibilities

• Develop and optimize packaging assembly processes to meet quality and cost targets.
• Design experiments using SPC and DOE to characterize processes and drive improvements.
• Innovate techniques, materials, and tools to address packaging challenges.
• Collaborate with cross-functional teams to identify risks and enable product launches.
• Establish material/equipment specifications and document findings.

Skills

Data analysis

Risk assessment methodologies

Collaborative teamwork

Education

Master's degree or PhD in Mechanical Engineering, Physics, Chemistry, or related STEM field

Tools

Python

MATLAB

SQL

Job description

Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, Arizona seeks a Packaging Module Development Engineer to advance packaging processes, drive optimization, and qualification for high‑volume production.

You will design and execute experiments using SPC and DOE, collaborate with cross‑functional engineering, manufacturing, and product teams, and contribute to reliable, cost‑effective packaging solutions that scale globally.