Advanced Packaging Process Engineer

Intel Corporation; Chandler (AZ); On-site; USD 115,000 - 220,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Job summary

Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, Arizona seeks a Packaging Module Development Engineer to advance packaging processes, drive optimization, and qualification for high‑volume production.

You will design and execute experiments using SPC and DOE, collaborate with cross‑functional engineering, manufacturing, and product teams, and contribute to reliable, cost‑effective packaging solutions that scale globally.

Qualifications

• MSc or PhD in a STEM field with 1+ years in related work or 3+ years experience with a Master’s degree.
• Experience in manufacturing environment and process development.
• Familiarity with SPC, DOE, data analysis, and packaging/reliability concepts.

Responsibilities

• Develop and optimize packaging assembly processes to meet quality and cost targets.
• Design experiments using SPC and DOE to characterize processes and drive improvements.
• Innovate techniques, materials, and tools to address packaging challenges.
• Collaborate with cross-functional teams to identify risks and enable product launches.
• Establish material/equipment specifications and document findings.

Skills

Data analysis

Risk assessment methodologies

Collaborative teamwork

Education

Master's degree or PhD in Mechanical Engineering, Physics, Chemistry, or related STEM field

Tools

Python

MATLAB

SQL

Job description

Intel is one of the world's most iconic technology companies, driving innovation in semiconductors for over five decades. From the chips that power your laptop to the processors enabling artificial intelligence and autonomous vehicles, Intel's technology is woven into the fabric of modern life. Our Advanced Packaging Technology Manufacturing (APTM) organization is at the heart of Intel's next chapter — developing and commercializing the packaging technologies that will define the future of computing. We are committed to building a diverse, inclusive, and innovative workplace where every employee can do their best work and make a real difference. We are looking for a talented and driven Packaging Module Development Engineer to join our APTM team at Intel's world-class manufacturing campus in Chandler, Arizona. In this role, you will be a key contributor to the development, optimization, and qualification of advanced semiconductor packaging processes — work that directly enables Intel's products to reach billions of people around the world. Whether you're a recent PhD graduate eager to apply your research expertise or an experienced engineer ready to take on new challenges, this is an opportunity to do meaningful, high-impact work alongside some of the best engineers in the semiconductor industry.

Key Responsibilities

• Develop and optimize packaging assembly processes and equipment to meet stringent quality, reliability, yield, and cost targets in high-volume manufacturing environments.
• Design and execute experiments using Statistical Process Control (SPC) and Design of Experiments (DOE) to characterize processes and drive continuous improvement.
• Innovate new techniques, materials, and tools to address emerging challenges in semiconductor packaging performance and reliability.
• Collaborate with cross-functional teams across engineering, manufacturing, and product development to identify technical risks and ensure successful product launches.
• Establish specifications for materials and equipment, ensuring adherence to Intel's quality and operational standards.
• Document and communicate technical findings, process improvements, and experimental results through reports, white papers, and qualification documents.
• Lead standardization efforts for manufacturing systems, equipment setups, and process flows across Intel's global sites.

As a Successful Candidate, You Will Bring

• Intellectual curiosity — a genuine passion for understanding how things work and a drive to continuously learn and improve.
• Collaborative spirit — the willingness to work effectively with diverse, cross-functional teams and build strong working relationships.
• Resilience and adaptability — comfort navigating ambiguity and the skills to pivot quickly when challenges arise.
• Clear communication — the skills to translate complex technical findings into clear, actionable insights for a variety of audiences.
• Ownership mindset — a proactive approach to taking responsibility for outcomes and driving projects to completion.
• Creative problem-solving — the skills to think outside the box and develop innovative solutions to complex engineering challenges.

Qualifications

Minimum Qualifications

• Master's and 3+ years in relevant experience, or PhD in Mechanical Engineering, Physics, Chemistry, or a related STEM field with 1+ years of experience.
• Process development and equipment qualification in a manufacturing setting.

Preferred Qualifications

• 3+ years of experience in Data analysis and risk assessment methodologies.
• Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques.
• Semiconductor fabrication processes, assembly methodologies, and packaging flows (e.g., flip chip, fan-out, 2.5D/3D integration).
• Programming languages such as Python, MATLAB, or SQL for complex data analysis.
• Quality systems, documentation standards, and packaging reliability evaluation tools.

This Position is not eligible for Intel immigration sponsorship.

Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Employment Details

Job Type: College Grad Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations:

Position of Trust N/A

Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD

Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Work Model for this Role: This role will require an on-site presence.

Job posting details (such as work model, location or time type) are subject to change.