Packaging Multiphysics Simulation Engineer

Intel; Phoenix (AZ); On-site; USD 133,800 - 255,200; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plans

Vacation

Job summary

Intel is seeking a Mechanical Engineer for the Advanced Packaging Mechanical Analysis team in Chandler, AZ. This position focuses on developing advanced finite element analysis simulations for semiconductor packaging, requiring regular onsite presence.

The ideal candidate will possess a PhD in Mechanical Engineering and relevant experience in thermal-mechanical research and Finite Element Analysis tools. The role offers a competitive salary and benefits package, reflecting the industry’s best.

Qualifications

• PhD in Mechanical Engineering, Chemical Engineering or Material Sciences.
• 3+ years of thermal-mechanical work/research experience.
• 3+ years of experience with Finite Element Analysis tools.

Responsibilities

• Develop and validate finite element analysis models for semiconductor packages.
• Collaborate with teams to define simulation requirements and provide recommendations.
• Utilize both simulations and experiments to solve engineering problems.

Skills

Finite Element Analysis

Thermal-mechanical research

Experimental material characterization

Python

Multiphysics simulations

Education

PhD Degree in Mechanical Engineering or related field

Tools

DMA/TMA

Nano-indentation

Job description

Intel is seeking a Mechanical Engineer for the Advanced Packaging Mechanical Analysis team in Chandler, AZ. This position focuses on developing advanced finite element analysis simulations for semiconductor packaging, requiring regular onsite presence.

The ideal candidate will possess a PhD in Mechanical Engineering and relevant experience in thermal-mechanical research and Finite Element Analysis tools. The role offers a competitive salary and benefits package, reflecting the industry’s best.