Semiconductor Packaging Mechanical Design Engineer

Intel; Phoenix (AZ); On-site; USD 106,000 - 149,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation plan

Job summary

Intel in the United States (Phoenix, Arizona) is seeking a proactive Mechanical Design Engineer to lead collateral design for semiconductor packaging. You will design and develop mechanical components and tooling across packaging and assembly life cycles.

The role requires strong communication, time and project management, and cross-functional collaboration. Requires a Bachelor’s in mechanical engineering or STEM, 1+ year CAD experience, and on-site work in the US.

Qualifications

• Bachelor's degree in mechanical engineering or STEM field.
• 1+ year of experience with 2D and 3D CAD software.
• Ability to read and generate technical drawings and specifications.

Responsibilities

• Design and develop mechanical components and tooling for semiconductor packaging.
• Create and maintain CAD models and detailed drawings for substrates, IHS, stiffeners, and package assemblies.
• Collaborate with architecture, process, and assembly teams to ensure manufacturability.
• Act as a single point of contact for packaging mechanical design collateral.
• Identify and solve design and process issues to meet project timelines.

Skills

2D CAD

3D CAD

Technical drawings

Spatial reasoning

Education

Bachelor's in Mechanical Engineering or STEM

Master's degree (preferred)

Tools

SolidWorks

Siemens NX

AutoCAD

Job description

Intel in the United States (Phoenix, Arizona) is seeking a proactive Mechanical Design Engineer to lead collateral design for semiconductor packaging. You will design and develop mechanical components and tooling across packaging and assembly life cycles.

The role requires strong communication, time and project management, and cross-functional collaboration. Requires a Bachelor’s in mechanical engineering or STEM, 1+ year CAD experience, and on-site work in the US.